Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11872647 | Production method of additive manufactured object using pure copper powder having Si coating | Hirofumi Watanabe, Hiroyoshi Yamamoto, Yoshitaka Shibuya, Kenji Sato, Akihiko Chiba +1 more | 2024-01-16 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2019-11-05 |
| 10194534 | Printed wiring board, electronic device, catheter, and metallic material | Hideta Arai, Atsushi Miki | 2019-01-29 |
| 9724896 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2017-08-08 |
| 8137460 | Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystal | Misao Takakusaki, Takayuki Shimizu | 2012-03-20 |