Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394723 | Alignment device and alignment method | Shohei HAMADA, Hidetoshi Nishiyama | 2025-08-19 |
| 12291921 | Depressurized multilayered glass panel | Akito Takeuchi, Tatsuhiro Nakazawa | 2025-05-06 |
| 11637566 | Storage device and control method for storage device | — | 2023-04-25 |
| 11382217 | Surface treated copper foil, copper clad laminate, and printed circuit board | Nobuaki Miyamoto | 2022-07-05 |
| 11375624 | Surface treated copper foil, copper clad laminate, and printed circuit board | Nobuaki Miyamoto | 2022-06-28 |
| 11337315 | Surface treated copper foil, copper clad laminate, and printed circuit board | Nobuaki Miyamoto | 2022-05-17 |
| 11337314 | Surface treated copper foil, copper clad laminate, and printed circuit board | Nobuaki Miyamoto | 2022-05-17 |
| 11294753 | Information processing apparatus and method for collecting communication cable log | — | 2022-04-05 |
| 11279653 | Method for manufacturing glass panel, and glass panel | Tetsuo Minaai, Tatsuhiro Nakazawa | 2022-03-22 |
| 11124450 | Glass panel and glass window | Tetsuo Minaai, Tatsuhiro Nakazawa | 2021-09-21 |
| 11070220 | Correction device for A/D converter and A/D conversion device | — | 2021-07-20 |
| 10992378 | Information processing apparatus and optical fiber inspection method | — | 2021-04-27 |
| 10925170 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Ryo Fukuchi | 2021-02-16 |
| 10925171 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Ryo Fukuchi | 2021-02-16 |
| 10820414 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Hideta Arai, Ryo Fukuchi | 2020-10-27 |
| 10791631 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Ryo Fukuchi | 2020-09-29 |
| 10771150 | Parallel processing apparatus and replacing method of failing optical transmission line | — | 2020-09-08 |
| 10664339 | Information processing apparatus, information processing system, and information processing apparatus control method | — | 2020-05-26 |
| 10602620 | Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device | Kazuki Kanmuri | 2020-03-24 |
| 10581555 | Information processing device and burst error reproducing method | Masahiro Maeda | 2020-03-03 |
| 10529992 | Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil | Hideta Arai | 2020-01-07 |
| 10472728 | Copper foil for printed circuit | Hideta Arai | 2019-11-12 |
| 10476391 | Voltage converting device | — | 2019-11-12 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi | 2019-11-05 |
| 10383222 | Surface-treated copper foil | Ryo Fukuchi, Hideta Arai | 2019-08-13 |