Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10925170 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Atsushi Miki | 2021-02-16 |
| 10925171 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Atsushi Miki | 2021-02-16 |
| 10820414 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Hideta Arai, Atsushi Miki | 2020-10-27 |
| 10791631 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Atsushi Miki | 2020-09-29 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Atsushi Miki | 2019-11-05 |
| 10448507 | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna | — | 2019-10-15 |
| 10383222 | Surface-treated copper foil | Atsushi Miki, Hideta Arai | 2019-08-13 |
| 10070521 | Surface-treated copper foil | — | 2018-09-04 |
| 9724896 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Atsushi Miki | 2017-08-08 |
| 9060431 | Liquid crystal polymer copper-clad laminate and copper foil used for said laminate | Hideta Arai, Kengo Kaminaga, Atsushi Miki | 2015-06-16 |
| 8668994 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Keisuke Yamanishi, Kengo Kaminaga | 2014-03-11 |
| 8580390 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Keisuke Yamanishi, Kengo Kaminaga | 2013-11-12 |
| 8357307 | Method of forming electronic circuit | Keisuke Yamanishi, Kengo Kaminaga | 2013-01-22 |