Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843934 | High purity tungsten pentachloride and method for synthesizing same | Hideyuki Takahashi | 2020-11-24 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2019-11-05 |
| 9724896 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2017-08-08 |
| 8643060 | Method for manufacturing epitaxial crystal substrate, epitaxial crystal substrate and semiconductor device | Koji Kakuta | 2014-02-04 |