Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9730332 | Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate | Hideta Arai, Atsushi Miki, Kohsuke Arai | 2017-08-08 |
| 9504149 | Surface treated copper foil and laminate using the same | Hideta Arai, Atsushi Miki, Kohsuke Arai | 2016-11-22 |
| 9232650 | Surface treated copper foil and laminate using the same | Hideta Arai, Atsushi Miki, Kohsuke Arai | 2016-01-05 |