Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8230588 | Method of making an electronic device and electronic device substrate | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2012-07-31 |
| 8230591 | Method for fabricating an electronic device substrate | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida, Mamoru Mita | 2012-07-31 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida, Mamoru Mita | 2012-01-24 |
| 7939935 | Electronic device substrate, electronic device and methods for fabricating the same | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2011-05-10 |
| 7880091 | Electronic device substrate, electronic device and methods for making same | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2011-02-01 |
| 7780836 | Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same | Nobuaki Miyamoto, Mamoru Mita | 2010-08-24 |
| 7705245 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Nobuaki Miyamoto, Koki Hirasawa, Kenji Uchida | 2010-04-27 |
| 7681310 | Method for fabricating double-sided wiring board | Nobuaki Miyamoto | 2010-03-23 |
| 7268408 | Wiring board, method for manufacturing wiring board and electronic component using wiring board | Akira Matsuura, Takayuki Yoshiwa, Mamoru Mita, Takashi Kageyama, Katsutoshi Taga | 2007-09-11 |
| 6969910 | Semiconductor device, wiring board and method of making same | — | 2005-11-29 |
| 6943100 | Method of fabricating a wiring board utilizing a conductive member having a reduced thickness | Akira Matsuura | 2005-09-13 |
| 6670718 | Wiring board utilizing a conductive member having a reduced thickness | Akira Matsuura | 2003-12-30 |