Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145795 | Light emitting apparatus and method for manufacturing same | Nodoka Oyamada, Yuji Omori | 2021-10-12 |
| 10714460 | Light emitting device and manufacturing method thereof | Sadato Imai, Masahide Watanabe, Hirohiko Ishii | 2020-07-14 |
| 10629786 | Light emitting device and manufacturing method thereof | Sadato Imai, Masahide Watanabe, Hirohiko Ishii | 2020-04-21 |
| 10559722 | Light-emitting device | Yuji Omori, Sadato Imai | 2020-02-11 |
| 10267489 | Light-emitting apparatus | Yuji Omori, Makoto Yasuhara | 2019-04-23 |
| 10181553 | Semiconductor device and method for producing the same | Kazuki Matsumura, Takashi Iino | 2019-01-15 |
| 10158056 | LED package, light emitting device and method for manufacturing LED package | Sadato Imai, Masahide Watanabe, Hirohiko Ishii, Yuji Omori | 2018-12-18 |
| 9327457 | Electronic device and method for manufacturing electronic device | Kenji Uchida | 2016-05-03 |
| 8986588 | Electronic device and process for manufacturing electronic device | Kenji Uchida | 2015-03-24 |
| 8270177 | Electronic device and method for manufacturing electronic device | Kenji Uchida | 2012-09-18 |
| 8252408 | Electronic device and method of manufacturing the electronic device | Kenji Uchida | 2012-08-28 |
| 8243461 | Electronic device and process for manufacturing electronic device | Kenji Uchida | 2012-08-14 |
| 8230588 | Method of making an electronic device and electronic device substrate | Nobuaki Miyamoto, Akira Chinda, Kenji Uchida | 2012-07-31 |
| 8230591 | Method for fabricating an electronic device substrate | Akira Chinda, Nobuaki Miyamoto, Kenji Uchida, Mamoru Mita | 2012-07-31 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Akira Chinda, Nobuaki Miyamoto, Kenji Uchida, Mamoru Mita | 2012-01-24 |
| 7998781 | Method of manufacturing semiconductor device in which functional portion of element is exposed | Kenji Uchida | 2011-08-16 |
| 7939935 | Electronic device substrate, electronic device and methods for fabricating the same | Akira Chinda, Nobuaki Miyamoto, Kenji Uchida | 2011-05-10 |
| 7880091 | Electronic device substrate, electronic device and methods for making same | Nobuaki Miyamoto, Akira Chinda, Kenji Uchida | 2011-02-01 |
| 7880279 | Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same | Kenji Uchida, Katsumi Shimada, Shinjiro Uenishi, Shinya Ota | 2011-02-01 |
| 7705245 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Nobuaki Miyamoto, Akira Chinda, Kenji Uchida | 2010-04-27 |
| 7291905 | Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device | Hiroyuki Kimura | 2007-11-06 |
| 7236373 | Electronic device capable of preventing electromagnetic wave from being radiated | Kenji Uchida, Tatsuya Ohtaka, Kazuhisa Kishino, Sachio Suzuki | 2007-06-26 |
| 6829266 | Optical semiconductor device increasing productivity and method of fabricating the same | Kenji Uchida | 2004-12-07 |
| 6555763 | Multilayered circuit board for semiconductor chip module, and method of manufacturing the same | Teruo Ono | 2003-04-29 |
| 6548880 | Optical semiconductor device and a method of manufacturing the same | — | 2003-04-15 |