Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9955583 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | Masafumi Ishii, Nobuaki Miyamoto | 2018-04-24 |
| 9211241 | Oral composition | Takuya Saito, Yoshitaka Yano, Mika Nagayama | 2015-12-15 |