Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937390 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more | 2015-01-20 |
| 8704352 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more | 2014-04-22 |
| 8513121 | Semiconductor memory device and manufacturing method thereof | Hiroaki Ikeda, Kayoko Shibata | 2013-08-20 |
| 8334465 | Wafer of circuit board and joining structure of wafer or circuit board | Hiroaki Ikeda, Hideharu Miyake, Shiro Uchiyama, Hiroyuki Tenmei, Kunihiko Nishi +2 more | 2012-12-18 |
| 8298940 | Semiconductor memory device and manufacturing method thereof | Hiroaki Ikeda, Kayoko Shibata | 2012-10-30 |
| 7893540 | Semiconductor memory device and manufacturing method thereof | Hiroaki Ikeda, Kayoko Shibata | 2011-02-22 |
| 7791196 | Semiconductor device having a smaller electrostatic capacitance electrode | Hiroaki Ikeda | 2010-09-07 |
| 7754581 | Method for manufacturing a three-dimensional semiconductor device and a wafer used therein | Hiroaki Ikeda, Hiroyuki Tenmei, Naoya Kanda, Yasuhiro Naka, Kunihiko Nishi | 2010-07-13 |
| 7638362 | Memory module with improved mechanical strength of chips | Hiroaki Ikeda | 2009-12-29 |
| 7618847 | Bonding method of semiconductor and laminated structure fabricated thereby | Hiroyuki Tenmei, Kunihiko Nishi, Yasuhiro Naka, Nae Hisano, Hiroaki Ikeda | 2009-11-17 |
| 7576433 | Semiconductor memory device and manufacturing method thereof | Hiroaki Ikeda, Kayoko Shibata | 2009-08-18 |
| 7564127 | Memory module that is capable of controlling input/output in accordance with type of memory chip | Hiroaki Ikeda | 2009-07-21 |
| 6137185 | Electrode structure of a wiring substrate of semiconductor device having expanded pitch | Ryohei Satoh, Mamoru Mita | 2000-10-24 |
| 5939789 | Multilayer substrates methods for manufacturing multilayer substrates and electronic devices | Michifumi Kawai, Ryohei Satoh, Osamu Yamada, Eiji Matsuda, Takashi Inoue +2 more | 1999-08-17 |
| 5886409 | Electrode structure of wiring substrate of semiconductor device having expanded pitch | Ryohei Satoh, Mamoru Mita | 1999-03-23 |
| 5670421 | Process for forming multilayer wiring | Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Hiroki Nezu +1 more | 1997-09-23 |
| 5498768 | Process for forming multilayer wiring | Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Hiroki Nezu +1 more | 1996-03-12 |
| 5320729 | Sputtering target | Yasunori Narizuka, Akihiro Kenmotsu, Yoshitaka Chiba, Akitoshi Hiraki | 1994-06-14 |
| 5285016 | Wiring board provided with a heat bypass layer | Yasunori Narizuka, Akihiro Kemmotsu, Eiji Matsuzaki | 1994-02-08 |
| 5235313 | Thin film resistor and wiring board using the same | Yasunori Narizuka, Syoozi Ikeda, Akira Yabushita, Juichi Kishida | 1993-08-10 |