MI

Masakazu Ishino

EM Elpida Memory: 10 patents #58 of 692Top 9%
HI Hitachi: 9 patents #4,653 of 28,497Top 20%
PS Ps4 Luxco S.A.R.L.: 1 patents #127 of 276Top 50%
Overall (All Time): #223,947 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8937390 Semiconductor device having a liquid cooling module Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more 2015-01-20
8704352 Semiconductor device having a liquid cooling module Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more 2014-04-22
8513121 Semiconductor memory device and manufacturing method thereof Hiroaki Ikeda, Kayoko Shibata 2013-08-20
8334465 Wafer of circuit board and joining structure of wafer or circuit board Hiroaki Ikeda, Hideharu Miyake, Shiro Uchiyama, Hiroyuki Tenmei, Kunihiko Nishi +2 more 2012-12-18
8298940 Semiconductor memory device and manufacturing method thereof Hiroaki Ikeda, Kayoko Shibata 2012-10-30
7893540 Semiconductor memory device and manufacturing method thereof Hiroaki Ikeda, Kayoko Shibata 2011-02-22
7791196 Semiconductor device having a smaller electrostatic capacitance electrode Hiroaki Ikeda 2010-09-07
7754581 Method for manufacturing a three-dimensional semiconductor device and a wafer used therein Hiroaki Ikeda, Hiroyuki Tenmei, Naoya Kanda, Yasuhiro Naka, Kunihiko Nishi 2010-07-13
7638362 Memory module with improved mechanical strength of chips Hiroaki Ikeda 2009-12-29
7618847 Bonding method of semiconductor and laminated structure fabricated thereby Hiroyuki Tenmei, Kunihiko Nishi, Yasuhiro Naka, Nae Hisano, Hiroaki Ikeda 2009-11-17
7576433 Semiconductor memory device and manufacturing method thereof Hiroaki Ikeda, Kayoko Shibata 2009-08-18
7564127 Memory module that is capable of controlling input/output in accordance with type of memory chip Hiroaki Ikeda 2009-07-21
6137185 Electrode structure of a wiring substrate of semiconductor device having expanded pitch Ryohei Satoh, Mamoru Mita 2000-10-24
5939789 Multilayer substrates methods for manufacturing multilayer substrates and electronic devices Michifumi Kawai, Ryohei Satoh, Osamu Yamada, Eiji Matsuda, Takashi Inoue +2 more 1999-08-17
5886409 Electrode structure of wiring substrate of semiconductor device having expanded pitch Ryohei Satoh, Mamoru Mita 1999-03-23
5670421 Process for forming multilayer wiring Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Hiroki Nezu +1 more 1997-09-23
5498768 Process for forming multilayer wiring Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Hiroki Nezu +1 more 1996-03-12
5320729 Sputtering target Yasunori Narizuka, Akihiro Kenmotsu, Yoshitaka Chiba, Akitoshi Hiraki 1994-06-14
5285016 Wiring board provided with a heat bypass layer Yasunori Narizuka, Akihiro Kemmotsu, Eiji Matsuzaki 1994-02-08
5235313 Thin film resistor and wiring board using the same Yasunori Narizuka, Syoozi Ikeda, Akira Yabushita, Juichi Kishida 1993-08-10