Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6899603 | Polishing apparatus | Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma, Youhei Yamada, Takeshi Kimura | 2005-05-31 |
| 6719618 | Polishing apparatus | Yoshio Homma, Seiichi Kondo, Noriyuki Sakuma, Youhei Yamada, Takeshi Kimura | 2004-04-13 |
| 6565422 | Polishing apparatus using substantially abrasive-free liquid with mixture unit near polishing unit, and plant using the polishing apparatus | Yoshio Homma, Takeshi Kimura, Seiichi Kondo, Noriyuki Sakuma | 2003-05-20 |
| 5670421 | Process for forming multilayer wiring | Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Masakazu Ishino +1 more | 1997-09-23 |
| 5498768 | Process for forming multilayer wiring | Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Osamu Kasahara, Masakazu Ishino +1 more | 1996-03-12 |