OK

Osamu Kasahara

HI Hitachi: 22 patents #1,535 of 28,497Top 6%
HE Hitachi Vlsi Engineering: 12 patents #33 of 666Top 5%
HE Hitachi Kokusai Electric: 7 patents #134 of 843Top 20%
Canon: 2 patents #12,681 of 19,416Top 70%
Overall (All Time): #119,353 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 1–25 of 31 patents

Patent #TitleCo-InventorsDate
9096928 Method of manufacturing semiconductor device and substrate processing apparatus Ryota Sasajima, Yoshiro Hirose, Naonori Akae 2015-08-04
9023429 Method of manufacturing semiconductor device and substrate processing apparatus Yuichiro TAKESHIMA, Kazuyuki Toyoda, Junichi Tanabe, Katsuhiko Yamamoto, Hisashi Nomura 2015-05-05
8575042 Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatus Yosuke Ota, Yoshiro Hirose, Atsushi Sano, Kazuyuki Okuda, Kiyohiko Maeda 2013-11-05
8293646 Semiconductor device manufacturing method and substrate processing apparatus Takashi Ozaki, Takaaki Noda, Kiyohiko Maeda, Atsushi Moriya, Minoru Sakamoto 2012-10-23
7494941 Manufacturing method of semiconductor device, and substrate processing apparatus Kiyohiko Maeda, Akihiko Yoneda 2009-02-24
7033937 Apparatus and method for use in manufacturing a semiconductor device Kazuyuki Toyoda, Tsutomu Tanaka, Mamoru Sueyoshi, Nobuhito Shima, Masanori Sakai 2006-04-25
6894334 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 2005-05-17
6576063 Apparatus and method for use in manufacturing a semiconductor device Kazuyuki Toyoda, Tsutomu Tanaka, Mamoru Sueyoshi, Nobuhito Shima, Masanori Sakai 2003-06-10
6548847 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AND A TRANSITION-METAL NITRIDE FILM BETWEEN THE ALUMINUM WIRING STRIP AND THE TRANSITION-METAL FILM Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 2003-04-15
6342412 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 2002-01-29
6169324 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 2001-01-02
6127255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 2000-10-03
5917211 Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same Jun Murata, Yoshitaka Tadaki, Hiroko Kaneko, Toshihiro Sekiguchi, Hiroyuki Uchiyama +15 more 1999-06-29
5811316 Method of forming teos oxide and silicon nitride passivation layer on aluminum wiring Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1998-09-22
5780882 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1998-07-14
5773340 Method of manufacturing a BIMIS Takahiro Kumauchi, Takashi Hashimoto, Satoshi Yamamoto, Yoichi Tamaki, Takeo Shiba +1 more 1998-06-30
5739589 Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1998-04-14
5734188 Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same Jun Murata, Yoshitaka Tadaki, Hiroko Kaneko, Toshihiro Sekiguchi, Hiroyuki Uchiyama +15 more 1998-03-31
5670421 Process for forming multilayer wiring Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Hiroki Nezu, Masakazu Ishino +1 more 1997-09-23
5557147 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1996-09-17
5498768 Process for forming multilayer wiring Eisuke Nishitani, Susumu Tsuzuku, Shigeru Kobayashi, Hiroki Nezu, Masakazu Ishino +1 more 1996-03-12
5468989 Semiconductor integrated circuit device having an improved vertical bipolar transistor structure Hirotaka Nishizawa, Seiichiro Azuma, Kazuaki Ootoshi, Masataka Miyama, Shuji Kawata +1 more 1995-11-21
5331191 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1994-07-19
5264712 Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same Jun Murata, Yoshitaka Tadaki, Hiroko Kaneko, Toshihiro Sekiguchi, Hiroyuki Uchiyama +15 more 1993-11-23
5202275 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jun Sugiura, Osamu Tsuchiya, Makoto Ogasawara, Fumio Ootsuka, Kazuyoshi Torii +22 more 1993-04-13