Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955461 | Semiconductor assemblies with system and methods for aligning dies using registration marks | — | 2024-04-09 |
| 11380665 | Semiconductor dice assemblies, packages and systems, and methods of operation | Eiichi Nakano | 2022-07-05 |
| 10896875 | Forming conductive plugs for memory device | — | 2021-01-19 |
| 10600770 | Semiconductor dice assemblies, packages and systems, and methods of operation | Eiichi Nakano | 2020-03-24 |
| 10438888 | Forming conductive plugs for memory device | — | 2019-10-08 |
| 9997452 | Forming conductive plugs for memory device | — | 2018-06-12 |
| 8937390 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more | 2015-01-20 |
| 8722502 | Chip-stacked semiconductor device and manufacturing method thereof | — | 2014-05-13 |
| 8704352 | Semiconductor device having a liquid cooling module | Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more | 2014-04-22 |
| 8536711 | Chip-stacked semiconductor and manufacturing method thereof | — | 2013-09-17 |
| 8334465 | Wafer of circuit board and joining structure of wafer or circuit board | Masakazu Ishino, Hiroaki Ikeda, Hideharu Miyake, Hiroyuki Tenmei, Kunihiko Nishi +2 more | 2012-12-18 |
| 8004090 | Semiconductor device and method for manufacturing the same | — | 2011-08-23 |
| 7943470 | Chip-stacked semiconductor device and manufacturing method thereof | — | 2011-05-17 |
| 7897459 | Semiconductor device and manufacturing method thereof | — | 2011-03-01 |
| 7842610 | Semiconductor device | — | 2010-11-30 |
| 7732926 | Semiconductor device having a through electrode with a low resistance and method of manufacturing the same | — | 2010-06-08 |
| 7323785 | Semiconductor device | — | 2008-01-29 |