| 11955461 |
Semiconductor assemblies with system and methods for aligning dies using registration marks |
— |
2024-04-09 |
| 11380665 |
Semiconductor dice assemblies, packages and systems, and methods of operation |
Eiichi Nakano |
2022-07-05 |
| 10896875 |
Forming conductive plugs for memory device |
— |
2021-01-19 |
| 10600770 |
Semiconductor dice assemblies, packages and systems, and methods of operation |
Eiichi Nakano |
2020-03-24 |
| 10438888 |
Forming conductive plugs for memory device |
— |
2019-10-08 |
| 9997452 |
Forming conductive plugs for memory device |
— |
2018-06-12 |
| 8937390 |
Semiconductor device having a liquid cooling module |
Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more |
2015-01-20 |
| 8722502 |
Chip-stacked semiconductor device and manufacturing method thereof |
— |
2014-05-13 |
| 8704352 |
Semiconductor device having a liquid cooling module |
Nae Hisano, Shigeo Ohashi, Yasuo Osone, Yasuhiro Naka, Hiroyuki Tenmei +4 more |
2014-04-22 |
| 8536711 |
Chip-stacked semiconductor and manufacturing method thereof |
— |
2013-09-17 |
| 8334465 |
Wafer of circuit board and joining structure of wafer or circuit board |
Masakazu Ishino, Hiroaki Ikeda, Hideharu Miyake, Hiroyuki Tenmei, Kunihiko Nishi +2 more |
2012-12-18 |
| 8004090 |
Semiconductor device and method for manufacturing the same |
— |
2011-08-23 |
| 7943470 |
Chip-stacked semiconductor device and manufacturing method thereof |
— |
2011-05-17 |
| 7897459 |
Semiconductor device and manufacturing method thereof |
— |
2011-03-01 |
| 7842610 |
Semiconductor device |
— |
2010-11-30 |
| 7732926 |
Semiconductor device having a through electrode with a low resistance and method of manufacturing the same |
— |
2010-06-08 |
| 7323785 |
Semiconductor device |
— |
2008-01-29 |
