Issued Patents All Time
Showing 25 most recent of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424574 | Polymer coated semiconductor devices and hybrid bonding to form semiconductor assemblies | Wei Zhou, Ying-Ta Chiu | 2025-09-23 |
| 12362311 | Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods | Mark E. Tuttle | 2025-07-15 |
| 12300622 | Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication | — | 2025-05-13 |
| 12278202 | Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods | Bharat Bhushan, Akshay N. Singh, Bret K. Street, Debjit Datta | 2025-04-15 |
| 12243610 | Memory with parallel main and test interfaces | James B. Johnson, Kunal R. Parekh, Brent Keeth, Amy R. Griffin | 2025-03-04 |
| 12237299 | Systems and methods for direct bonding in semiconductor die manufacturing | Chia-Jung Hsu | 2025-02-25 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2025-01-14 |
| 12051670 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Shijian Luo | 2024-07-30 |
| 11915997 | Thermal management of GPU-HBM package by microchannel integrated substrate | Xiaopeng Qu, Hyunsuk Chun | 2024-02-27 |
| 11881468 | Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods | Mark E. Tuttle | 2024-01-23 |
| 11817420 | Systems and methods for direct bonding in semiconductor die manufacturing | Chia-Jung Hsu | 2023-11-14 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Owen R. Fay | 2023-10-17 |
| 11749608 | Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication | — | 2023-09-05 |
| 11621257 | Wafer-scale memory techniques | Brent Keeth, Bambi L DeLaRosa | 2023-04-04 |
| 11456278 | Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages | — | 2022-09-27 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2022-08-09 |
| 11380665 | Semiconductor dice assemblies, packages and systems, and methods of operation | Shiro Uchiyama | 2022-07-05 |
| 11189588 | Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods | Mark E. Tuttle | 2021-11-30 |
| 11171118 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Owen R. Fay | 2021-11-09 |
| 11139262 | Use of pre-channeled materials for anisotropic conductors | Mark E. Tuttle, John F. Kaeding, Owen R. Fay, Shijian Luo | 2021-10-05 |
| 11069612 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Mark E. Tuttle | 2021-07-20 |
| 10943860 | Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board | Chan H. Yoo | 2021-03-09 |
| 10854549 | Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems | — | 2020-12-01 |
| 10797018 | Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packages | — | 2020-10-06 |
| 10651050 | Semiconductor device packages and structures | — | 2020-05-12 |