AS

Akshay N. Singh

Micron: 16 patents #1,043 of 6,345Top 20%
Overall (All Time): #281,305 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12424590 Semiconductor device assemblies and associated methods Bharat Bhushan, Kunal R. Parekh 2025-09-23
12278202 Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods Bharat Bhushan, Bret K. Street, Debjit Datta, Eiichi Nakano 2025-04-15
12255163 Bond pads for semiconductor die assemblies and associated methods and systems Bharat Bhushan, Keizo Kawakita, Bret K. Street 2025-03-18
12191162 Semiconductor device assembly with pillar array Owen R. Fay, Kyle K. Kirby 2025-01-07
11973062 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2024-04-30
11631644 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2023-04-18
11587912 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2023-02-21
11094670 Semiconductor device assemblies including multiple shingled stacks of semiconductor dies Hong Wan Ng 2021-08-17
11088114 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2021-08-10
10998271 High density pillar interconnect conversion with stack to substrate connection Owen R. Fay, Kyle K. Kirby 2021-05-04
10943794 Semiconductor device assembly with pillar array and test ability Owen R. Fay, Kyle K. Kirby 2021-03-09
10529592 Semiconductor device assembly with pillar array Owen R. Fay, Kyle K. Kirby 2020-01-07
10522507 Semiconductor device assemblies including multiple shingled stacks of semiconductor dies Hong Wan Ng 2019-12-31
10366934 Face down dual sided chip scale memory package Chan H. Yoo, Yi Xu, Liana Foster, Steven Eskildsen 2019-07-30
10312219 Semiconductor device assemblies including multiple shingled stacks of semiconductor dies Hong Wan Ng 2019-06-04
10153221 Face down dual sided chip scale memory package Chan H. Yoo, Yi Xu, Liana Foster, Steven Eskildsen 2018-12-11