Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Steven Eskildsen | 2019-07-30 |
| 10153221 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Steven Eskildsen | 2018-12-11 |
| 9601374 | Semiconductor die assembly | Owen R. Fay | 2017-03-21 |