Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11385949 | Apparatus having a multiplexer for passive input/output expansion | Suresh Rajgopal, Dan Soto | 2022-07-12 |
| 11347415 | Selection component that is configured based on an architecture associated with memory devices | Suresh Rajgopal, Henrico L. Yahja, Dustin J. Carter | 2022-05-31 |
| 10877678 | Selection component that is configured based on an architecture associated with memory devices | Suresh Rajgopal, Henrico L. Yahja, Dustin J. Carter | 2020-12-29 |
| 10846158 | Apparatus having multiplexers for passive input/output expansion and methods of their operation | Suresh Rajgopal, Dan Soto | 2020-11-24 |
| 10366934 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Liana Foster | 2019-07-30 |
| 10153221 | Face down dual sided chip scale memory package | Chan H. Yoo, Akshay N. Singh, Yi Xu, Liana Foster | 2018-12-11 |
| 9269403 | Independent control of stacked electronic modules | Robert N. Schenck | 2016-02-23 |
| 8999763 | Package including an interposer having at least one topological feature | Aravind Ramamoorthy | 2015-04-07 |
| 8952515 | Signal shifting to allow independent control of identical stacked memory modules | Robert N. Schenck | 2015-02-10 |
| 8860496 | Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices | Mostafa Naguib Abdulla | 2014-10-14 |
| 8829693 | Supply voltage or ground connections for integrated circuit device | Mostafa Naguib Abdulla | 2014-09-09 |
| 8749074 | Package including an interposer having at least one topological feature | Aravind Ramamoorthy | 2014-06-10 |
| 8536716 | Supply voltage or ground connections for integrated circuit device | Mostafa Naguib Abdulla | 2013-09-17 |
| 8531849 | Supply voltage or ground connections including bond pad interconnects for integrated circuit device | Mostafa Naguib Abdulla | 2013-09-10 |
| 8198717 | Signal shifting to allow independent control of identical stacked memory modules | Robert N. Schenck | 2012-06-12 |
| 7823279 | Method for using an in package power supply to supply power to an integrated circuit and to a component | Duane R. Mills | 2010-11-02 |
| 7533457 | Packaging method for circuit board | Richard Foehringer, Jason Snodgress, John G. Meyers | 2009-05-19 |
| 6704204 | IC package with edge connect contacts | Jeffrey C. Franz, David S. Brannam | 2004-03-09 |
| 6655022 | Implementing micro BGA assembly techniques for small die | Richard Foehringer, Deborah S. Kaller | 2003-12-02 |
| 6605875 | Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size | — | 2003-08-12 |
| 6547570 | IC package with quick connect feature | Jeffrey C. Franz, David S. Brannam | 2003-04-15 |
| 6489557 | Implementing micro BGA™ assembly techniques for small die | Richard Foehringer, Deborah S. Kaller | 2002-12-03 |
| 6356456 | Low pin count card retainer | — | 2002-03-12 |
| 6250934 | IC package with quick connect feature | Jeffrey C. Franz, David S. Brannam | 2001-06-26 |
| 5336456 | Method of producing a scribelined layout structure for plastic encapsulated circuits | Suresh Golwalkar, Tito Barrios | 1994-08-09 |