Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7533457 | Packaging method for circuit board | Jason Snodgress, Steven Eskildsen, John G. Meyers | 2009-05-19 |
| 6812566 | Lower profile package with power supply in package | Eleanor Patricia Paras Rabadam | 2004-11-02 |
| 6744669 | Memory circuit including booster pump for programming voltage generation | Javanifard Jahanshir, Priya Walimbe | 2004-06-01 |
| 6655022 | Implementing micro BGA assembly techniques for small die | Steven Eskildsen, Deborah S. Kaller | 2003-12-02 |
| 6489557 | Implementing micro BGA™ assembly techniques for small die | Steven Eskildsen, Deborah S. Kaller | 2002-12-03 |
| 6469482 | Inductive charge pump circuit for providing voltages useful for flash memory and other applications | Javanifard Jahanshir, Priya Walimbe | 2002-10-22 |
| 5545922 | Dual sided integrated circuit chip package with offset wire bonds and support block cavities | Suresh Golwalkar, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-08-13 |
| 5527740 | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities | Suresh Golwalkar, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-06-18 |
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Suresh Golwalkar, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima | 1994-11-22 |