Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5545922 | Dual sided integrated circuit chip package with offset wire bonds and support block cavities | Suresh Golwalkar, Richard Foehringer, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-08-13 | $28,432,000 |
| 5527740 | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities | Suresh Golwalkar, Richard Foehringer, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-06-18 | $87,023,000 |
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Suresh Golwalkar, Richard Foehringer, Ryo Takatsuki, Shigeo Kawashima | 1994-11-22 | $19,549,000 |