Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960285 | Sensor-derived object flight performance tracking | Narayan Sundararajan, Xue Yang, Mahanth K. Gowda, Romit Roy Choudhury | 2021-03-30 |
| 10420999 | Sensor-derived object flight performance tracking | Narayan Sundararajan, Xue Yang, Mahanth K. Gowda, Romit Roy Choudhury | 2019-09-24 |
| 10049650 | Ultra-wide band (UWB) radio-based object sensing | Manan Goel, Saurin Shah, Lakshman Krishnamurthy, Francis M. Tharappel, Swarnendu Kar | 2018-08-14 |
| 7476037 | Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same | Noah Davis, John M. Burns, Kannan Raj, Phil McClay, Wuchun Chou +1 more | 2009-01-13 |
| 7101091 | Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same | Noah Davis, John M. Burns, Kannan Raj, Phil McClay, Wuchun Chou +1 more | 2006-09-05 |
| 7002249 | Microelectronic component with reduced parasitic inductance and method of fabricating | Thomas P. Duffy, John Ryan Goodfellow, Robert T. Carroll, Kevin Cote, Sampath Komarapalayam Velayudham Karikalan | 2006-02-21 |
| 6960031 | Apparatus and method of packaging two dimensional photonic array devices | Jonathan McFarland, Sampath Komarapalayam Velayudham Karikalan, Kevin Cote, Wu-Chun Chou | 2005-11-01 |
| 6850658 | Apparatus for coupling an optoelectronic device to a fiber optic cable and a microelectronic device, a system including the apparatus, and a method of forming the same | Noah Davis, John M. Burns, Jonathan McFarland, Kevin Cote | 2005-02-01 |
| 6786651 | Optical interconnect structure, system and transceiver including the structure, and method of forming the same | Kannan Raj, Wuchun Chou, C. McClay, Robert T. Carroll, Noah Davis +1 more | 2004-09-07 |
| 5545922 | Dual sided integrated circuit chip package with offset wire bonds and support block cavities | Richard Foehringer, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-08-13 |
| 5527740 | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities | Richard Foehringer, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-06-18 |
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Richard Foehringer, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima | 1994-11-22 |
| 5336456 | Method of producing a scribelined layout structure for plastic encapsulated circuits | Steven Eskildsen, Tito Barrios | 1994-08-09 |