Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076179 | Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure | — | 2011-12-13 |
| 7977801 | Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method | — | 2011-07-12 |
| 5545922 | Dual sided integrated circuit chip package with offset wire bonds and support block cavities | Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-08-13 |
| 5527740 | Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities | Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more | 1996-06-18 |
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima | 1994-11-22 |