| 8076179 |
Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure |
— |
2011-12-13 |
| 7977801 |
Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method |
— |
2011-07-12 |
| 5545922 |
Dual sided integrated circuit chip package with offset wire bonds and support block cavities |
Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more |
1996-08-13 |
| 5527740 |
Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more |
1996-06-18 |
| 5366933 |
Method for constructing a dual sided, wire bonded integrated circuit chip package |
Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima |
1994-11-22 |