Ryo Takatsuki — 5 Patents at Intel

Ryo Takatsuki has been granted 5 US patents while listed as an inventor at Intel. The first was granted in 1994 and the most recent in December 2011. Ryo Takatsuki ranks #907,971 of 4,157,543 US inventors in our database (top 21.8%). Patent records list Ryo Takatsuki in Ibaraki, JP.

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Showing 1–5 of 5 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8076179	Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure	—	2011-12-13
7977801	Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method	—	2011-07-12
5545922	Dual sided integrated circuit chip package with offset wire bonds and support block cavities	Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more	1996-08-13	$28,432,000
5527740	Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities	Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima, Keiichi Tsujimoto +1 more	1996-06-18	$87,023,000
5366933	Method for constructing a dual sided, wire bonded integrated circuit chip package	Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima	1994-11-22	$19,549,000

Ryo Takatsuki — 5 Patents

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