Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237300 | Through-substrate void filling for an integrated circuit assembly | Tyler Leuten, Yi Xu | 2025-02-25 |
| 12165983 | Stepped electronic substrate for integrated circuit packages | Maria Angela Damille Ramiso | 2024-12-10 |
| 6812566 | Lower profile package with power supply in package | Richard Foehringer | 2004-11-02 |