Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165983 | Stepped electronic substrate for integrated circuit packages | Eleanor Patricia Paras Rabadam | 2024-12-10 |
| 11495547 | Fiber reinforced stiffener | Florence R. Pon, Tyler Leuten | 2022-11-08 |
| 11399434 | Electronic package and method of forming an electronic package | Florence R. Pon, Tyler Leuten | 2022-07-26 |