Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237300 | Through-substrate void filling for an integrated circuit assembly | Yi Xu, Eleanor Patricia Paras Rabadam | 2025-02-25 |
| 12096566 | Reciprocal PCB manufacturing process | — | 2024-09-17 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, William T. Glennan +1 more | 2024-04-02 |
| 11811182 | Solderless BGA interconnect | Mohammed Rahman, Bilal Khalaf | 2023-11-07 |
| 11646253 | Ball interconnect structures for surface mount components | — | 2023-05-09 |
| 11562978 | Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same | Florence R. Pon, John Yap | 2023-01-24 |
| 11495547 | Fiber reinforced stiffener | Florence R. Pon, Maria Angela Damille Ramiso | 2022-11-08 |
| 11399434 | Electronic package and method of forming an electronic package | Florence R. Pon, Maria Angela Damille Ramiso | 2022-07-26 |
| 10910301 | Post-grind die backside power delivery | Min-Tih Lai, Florence R. Pon | 2021-02-02 |
| 10872880 | Land grid array package extension | Min-Tih Lai | 2020-12-22 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Mao Guo, Min-Tih Lai | 2020-08-18 |
| 10483198 | Post-grind die backside power delivery | Min-Tih Lai, Florence R. Pon | 2019-11-19 |
| 10304799 | Land grid array package extension | Min-Tih Lai | 2019-05-28 |
| 10032707 | Post-grind die backside power delivery | Min-Tih Lai, Florence R. Pon | 2018-07-24 |