Tyler Leuten — 14 Patents at Intel

Tyler Leuten has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2018 and the most recent in February 2025. Tyler Leuten ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Tyler Leuten in Grangeville, CA, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12237300	Through-substrate void filling for an integrated circuit assembly	Yi Xu, Eleanor Patricia Paras Rabadam	2025-02-25
12096566	Reciprocal PCB manufacturing process	—	2024-09-17	$19,251,000
11948917	Die over mold stacked semiconductor package	Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, William T. Glennan +1 more	2024-04-02	$34,819,000
11811182	Solderless BGA interconnect	Mohammed Rahman, Bilal Khalaf	2023-11-07	$22,371,000
11646253	Ball interconnect structures for surface mount components	—	2023-05-09	$19,706,000
11562978	Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same	Florence R. Pon, John Yap	2023-01-24	$19,543,000
11495547	Fiber reinforced stiffener	Florence R. Pon, Maria Angela Damille Ramiso	2022-11-08	$15,080,000
11399434	Electronic package and method of forming an electronic package	Florence R. Pon, Maria Angela Damille Ramiso	2022-07-26	$27,041,000
10910301	Post-grind die backside power delivery	Min-Tih Lai, Florence R. Pon	2021-02-02	$28,243,000
10872880	Land grid array package extension	Min-Tih Lai	2020-12-22	$47,741,000
10748873	Substrates, assembles, and techniques to enable multi-chip flip chip packages	Mao Guo, Min-Tih Lai	2020-08-18	$29,577,000
10483198	Post-grind die backside power delivery	Min-Tih Lai, Florence R. Pon	2019-11-19	$26,843,000
10304799	Land grid array package extension	Min-Tih Lai	2019-05-28	$17,387,000
10032707	Post-grind die backside power delivery	Min-Tih Lai, Florence R. Pon	2018-07-24	$23,531,000

Tyler Leuten — 14 Patents

Issued Patents All Time

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