Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Post-grind die backside power delivery

Post-grind die backside power delivery

US Patent 10032707 · Granted Jul 24, 2018

Estimated economic value: $23,531,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interposer with step feature2025
Computer-assisted or autonomous driving vehicles social network2025
Choked flow cooling2025
Through-substrate void filling for an integrated circuit assembly2025
Reciprocal PCB manufacturing process2024
Die stack with cascade and vertical connections2024
Die stack with cascade and vertical connections2024
Systems and methods for improving interactions with artificial intelligence mode2024
Die over mold stacked semiconductor package2024
Die over mold stacked semiconductor package2024
Choked flow cooling2024
Packaged integrated circuit device with recess structure2024