Bilal Khalaf — 20 Patents at Intel

Bilal Khalaf has been granted 20 US patents while listed as an inventor at Intel. The first was granted in 2017 and the most recent in February 2024. Bilal Khalaf ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Bilal Khalaf in Folsom, CA, US.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11894334	Dual head capillary design for vertical wire bond	Yuhong Cai, Yi Xu	2024-02-06	$35,892,000
11848311	Microelectronic packages having a die stack and a device within the footprint of the die stack	—	2023-12-19	$50,836,000
11817438	System in package with interconnected modules	Hyoung Il Kim, Juan E. Dominguez, John G. Meyers	2023-11-14
11811182	Solderless BGA interconnect	Tyler Leuten, Mohammed Rahman	2023-11-07	$22,371,000
11710674	Embedded component and methods of making the same	Yi Xu, Dennis Sean Carr	2023-07-25	$28,608,000
11700696	Buried electrical debug access port	Florence R. Neumann, Saeed S. Shojaie	2023-07-11	$21,736,000
11373974	Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size	Mao Guo	2022-06-28	$15,065,000
11329027	Microelectronic packages having a die stack and a device within the footprint of the die stack	—	2022-05-10	$19,182,000
11315843	Embedded component and methods of making the same	Yi Xu, Dennis Sean Carr	2022-04-26	$25,630,000
11145632	High density die package configuration on system boards	Juan E. Dominguez, Hyoung Il Kim, John G. Meyers	2021-10-12	$32,982,000
11064612	Buried electrical debug access port	Florence R. Pon, Saeed S. Shojaie	2021-07-13	$34,958,000
10879152	Through mold via (TMV) using stacked modular mold rings	Yi Xu	2020-12-29	$24,597,000
10847450	Compact wirebonding in stacked-chip system in package, and methods of making same	Saeed S. Shojaie, Hyoung Il Kim, Min-Tih Lai	2020-11-24	$25,522,000
10490516	Packaged integrated circuit device with cantilever structure	John G. Meyers, Sireesha Gogineni, Brian J. Long	2019-11-26	$25,149,000
10475766	Microelectronics package providing increased memory component density	—	2019-11-12	$21,873,000
10304814	I/O layout footprint for multiple 1LM/2LM configurations	Konika Ganguly, Robert J. Royer, Jr., Rebecca Z. Loop, Anthony M. CONSTANTINE	2019-05-28	$17,387,000
10090261	Microelectronic package debug access ports and methods of fabricating the same	Florence R. Pon, Saeed S. Shojaie	2018-10-02	$23,827,000
9972610	System-in-package logic and method to control an external packaged memory device	—	2018-05-15	$21,346,000
9871007	Packaged integrated circuit device with cantilever structure	John G. Meyers, Sireesha Gogineni, Brian J. Long	2018-01-16	$17,139,000
9646952	Microelectronic package debug access ports	Florence R. Pon, Saeed S. Shojaie	2017-05-09	$10,144,000

Bilal Khalaf — 20 Patents

Issued Patents All Time

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