Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic packages having a die stack and a device within the footprint of the die stack

Microelectronic packages having a die stack and a device within the footprint of the die stack

US Patent 11329027 · Granted May 10, 2022

Estimated economic value: $19,182,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dual head capillary design for vertical wire bond2024
Microelectronic packages having a die stack and a device within the footprint of2023
System in package with interconnected modules2023
Solderless BGA interconnect2023
Embedded component and methods of making the same2023
Buried electrical debug access port2023
Electronic device packages and methods for maximizing electrical current to dies2022
Embedded component and methods of making the same2022
High density die package configuration on system boards2021
Buried electrical debug access port2021
Through mold via (TMV) using stacked modular mold rings2020
Compact wirebonding in stacked-chip system in package, and methods of making sam2020