Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817438 | System in package with interconnected modules | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2023-11-14 |
| 11694987 | Active package substrate having anisotropic conductive layer | Hyoung Il Kim | 2023-07-04 |
| 11145632 | High density die package configuration on system boards | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2021-10-12 |
| 10790257 | Active package substrate having anisotropic conductive layer | Hyoung Il Kim | 2020-09-29 |
| 10497669 | Hybrid die stacking | Hyoung Il Kim | 2019-12-03 |
| 8425987 | Surface charge enhanced atomic layer deposition of pure metallic films | Adrien LaVoie, John J. Plombon, Harsono S. Simka | 2013-04-23 |
| 8344352 | Using unstable nitrides to form semiconductor structures | Adrien LaVoie, John J. Plombon, Joseph H. Han, Harsono S. Simka | 2013-01-01 |
| 8319287 | Tunable gate electrode work function material for transistor applications | Adrien LaVoie, Valery M. Dubin, John J. Plombon, Harsono S. Simka, Joseph H. Han +1 more | 2012-11-27 |
| 8222746 | Noble metal barrier layers | Adrien LaVoie, Aaron A. Budrevich | 2012-07-17 |
| 7982204 | Using unstable nitrides to form semiconductor structures | Adrien LaVoie, John J. Plombon, Joseph H. Han, Harsono S. Simka | 2011-07-19 |
| 7964746 | Copper precursors for CVD/ALD/digital CVD of copper metal films | Tianniu Chen, Chongying Xu, Thomas H. Baum, Bryan C. Hendrix, Jeffrey F. Roeder +2 more | 2011-06-21 |
| 7964174 | Nanotube growth and device formation | Valery M. Dubin, Chin-Chang Cheng | 2011-06-21 |
| 7858525 | Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill | Adrien LaVoie, John J. Plombon, Joseph H. Han, Harsono S. Simka, Bryan C. Hendrix +1 more | 2010-12-28 |
| 7851360 | Organometallic precursors for seed/barrier processes and methods thereof | Adrien LaVoie, John J. Plombon, Joseph H. Han, Harsono S. Simka, David Thompson +1 more | 2010-12-14 |
| 7749906 | Using unstable nitrides to form semiconductor structures | Adrien LaVoie, John J. Plombon, Joseph H. Han, Harsono S. Simka | 2010-07-06 |
| 7704895 | Deposition method for high-k dielectric materials | Adrien LaVoie, John J. Plombon, Harsono S. Simka, Mansour Moinpour | 2010-04-27 |
| 7687225 | Optical coatings | Sergei Koveshnikov, Kyle Flanigan, Ernisse Putna | 2010-03-30 |
| 7687911 | Silicon-alloy based barrier layers for integrated circuit metal interconnects | Adrien LaVoie | 2010-03-30 |
| 7682891 | Tunable gate electrode work function material for transistor applications | Adrien LaVoie, Valery M. Dubin, John J. Plombon, Harsono S. Simka, Joseph H. Han +1 more | 2010-03-23 |
| 7635503 | Composite metal films and carbon nanotube fabrication | Valery M. Dubin, Florian Gstrein, Michael Goldstein | 2009-12-22 |
| 7625817 | Method of fabricating a carbon nanotube interconnect structures | Florian Gstrein, Valery M. Dubin, Adrien LaVoie | 2009-12-01 |
| 7550385 | Amine-free deposition of metal-nitride films | Adrien LaVoie, Valery M. Dubin, Kevin P. O'Brien, Steven W. Johnston, John D. Peck +2 more | 2009-06-23 |
| 7507521 | Silicon based optically degraded arc for lithographic patterning | Kyle Flanigan, Sergei Koveshnikov, Ernisse Putna | 2009-03-24 |
| 7476615 | Deposition process for iodine-doped ruthenium barrier layers | Joseph H. Han, Harsono S. Simka, Adrien LaVoie, John J. Plombon | 2009-01-13 |
| 7459392 | Noble metal barrier and seed layer for semiconductors | Steven W. Johnston, Michael L. McSwiney | 2008-12-02 |