| 12497694 |
Method of forming low-resistivity Ru ALD through a bi-layer process and related structures |
Andrew C. Kummel, Michael Breeden, Victor Wang, Ravindra KANJOLIA, Harsono S. Simka |
2025-12-16 |
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| 12180583 |
Methods of forming low resistivity titanium nitride thin film in horizontal vias and related devices |
Andrew C. Kummel, Cheng-Hsuan Kuo, SeongUk Yun, Ravindra KANJOLIA, Daniel Moser |
2024-12-31 |
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| 7704895 |
Deposition method for high-k dielectric materials |
Adrien LaVoie, John J. Plombon, Juan E. Dominguez, Harsono S. Simka |
2010-04-27 |
$12,857,000 |
| 7469443 |
Brush for cleaning wafer |
Huey-Chiang Liou, Alexander Tregub |
2008-12-30 |
$13,967,000 |
| 7470450 |
Forming a silicon nitride film |
Michael L. McSwiney, Michael Goodner |
2008-12-30 |
$13,967,000 |
| 7405419 |
Unidirectionally conductive materials for interconnection |
Reza Golzarian, Robert Meagley, Seiichi Morimoto |
2008-07-29 |
$26,149,000 |
| 7383723 |
Detecting particle agglomeration in chemical mechanical polishing slurries |
Alexander Tregub |
2008-06-10 |
$23,380,000 |
| 7365375 |
Organic-framework zeolite interlayer dielectrics |
Michael Goodner, Grant Kloster, Boyan Boyanov |
2008-04-29 |
$13,885,000 |
| 7229484 |
Pre-coated particles for chemical mechanical polishing |
Reza Golzarian, Andrea Oehler |
2007-06-12 |
$15,149,000 |
| 7125321 |
Multi-platen multi-slurry chemical mechanical polishing process |
Matthew J. Prince, Francis M. Tambwe, Gary Ding |
2006-10-24 |
$13,658,000 |
| 7084053 |
Unidirectionally conductive materials for interconnection |
Reza Golzarian, Robert Meagley, Seiichi Morimoto |
2006-08-01 |
$14,842,000 |
| 7048434 |
Thermal analysis and characterization of layers and multiple layer structures |
Alex Tregub, David Fryer |
2006-05-23 |
$10,027,000 |
| 7048610 |
Conditioning polishing pad for chemical-mechanical polishing |
Alexander Tregub, Victor K. Souw |
2006-05-23 |
$10,027,000 |
| 6976907 |
Polishing pad conditioning |
Reza Golzarian |
2005-12-20 |
$37,307,000 |
| 6875086 |
Surface planarization |
Reza Golzarian |
2005-04-05 |
$32,622,000 |
| 6495470 |
Contact and via fabrication technologies |
S. M. Reza Sadjadi, Te Hua Lin, Farhad Moghadam |
2002-12-17 |
$45,119,000 |
| 6365521 |
Passivation for tight metal geometry |
Jan V. Shubert, Glen Wada, Yang-Chin Shih, Ken Schatz |
2002-04-02 |
$46,572,000 |
| 6334229 |
Apparatus for cleaning edges of contaminated substrates |
Hoang T. Nguyen, Mohsen Salek, Young C. Park, Tom Bramblett, John deLarios +3 more |
2002-01-01 |
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| 5883436 |
Contact and via fabrication technologies |
S. M. Reza Sadjadi, Te Hua Lin, Farhad Moghadam |
1999-03-16 |
$139,495,000 |
| 5861066 |
Method and apparatus for cleaning edges of contaminated substrates |
Hoang T. Nguyen, Mohsen Salek, Young C. Park, Tom Bramblett, John deLarios +3 more |
1999-01-19 |
$152,384,000 |
