TL

Te Hua Lin

IN Intel: 2 patents #13,213 of 30,777Top 45%
Lam Research: 1 patents #1,364 of 2,128Top 65%
Overall (All Time): #1,613,084 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6653224 Methods for fabricating interconnect structures having Low K dielectric properties Yehiel Gotkis, Rodney Kistler, Leonid Romm 2003-11-25
6495470 Contact and via fabrication technologies S. M. Reza Sadjadi, Mansour Moinpour, Farhad Moghadam 2002-12-17
5883436 Contact and via fabrication technologies S. M. Reza Sadjadi, Mansour Moinpour, Farhad Moghadam 1999-03-16