| 12136537 |
Cost effective radio frequency impedance matching networks |
Yue Guo, Kartik Ramaswamy, Yang Yang |
2024-11-05 |
$79,202,000 |
| 11631583 |
RF power source operation in plasma enhanced processes |
Hari Ponnekanti, Dmitry A. Dzilno |
2023-04-18 |
$36,767,000 |
| 7799698 |
Deposition-selective etch-deposition process for dielectric film gapfill |
Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more |
2010-09-21 |
$8,059,000 |
| 7691753 |
Deposition-selective etch-deposition process for dielectric film gapfill |
Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more |
2010-04-06 |
$18,503,000 |
| 7560377 |
Plasma processes for depositing low dielectric constant films |
David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more |
2009-07-14 |
$33,730,000 |
| 7514353 |
Contact metallization scheme using a barrier layer over a silicide layer |
Timothy Weidman, Kapila Wijekoon, Zhize Zhu, Avgerinos V. Gelatos, Amit Khandelwal +3 more |
2009-04-07 |
$14,489,000 |
| 7431585 |
Apparatus and method for heating substrates |
Jun Zhao, David H. Quach, Timothy Weidman, Rick J. Roberts, Dan Maydan |
2008-10-07 |
$9,830,000 |
| 7399388 |
Sequential gas flow oxide deposition technique |
Michael S. Cox, Padmanabhan Krishnaraj, Thanh Pham |
2008-07-15 |
$16,085,000 |
| 7381052 |
Apparatus and method for heating substrates |
Jun Zhao, David H. Quach, Timothy Weidman, Rick J. Roberts, Dan Maydan |
2008-06-03 |
$34,287,000 |
| 7256139 |
Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices |
Jun Zhao, Timothy Weidman, Rick J. Roberts, Li Xia, Alexandros T. Demos |
2007-08-14 |
$16,337,000 |
| 7227244 |
Integrated low k dielectrics and etch stops |
Claes Bjorkman, Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more |
2007-06-05 |
$16,579,000 |
| 7160821 |
Method of depositing low k films |
Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau +5 more |
2007-01-09 |
$17,755,000 |
| 7151053 |
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications |
Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more |
2006-12-19 |
$47,258,000 |
| 7097886 |
Deposition process for high aspect ratio trenches |
Michael S. Cox, Padmanabhan Krishnaraj, Thanh Pham, Zhenjiang Cui |
2006-08-29 |
$18,591,000 |
| 7081414 |
Deposition-selective etch-deposition process for dielectric film gapfill |
Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more |
2006-07-25 |
$27,016,000 |
| 6958112 |
Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation |
M. Ziaul Karim, Siamak Salimian |
2005-10-25 |
$29,274,000 |
| 6936551 |
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices |
Jun Zhao, Timothy Weidman, Rick J. Roberts, Li-Qun Xia, Alexandros T. Demos |
2005-08-30 |
$15,796,000 |
| 6930061 |
Plasma processes for depositing low dielectric constant films |
David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more |
2005-08-16 |
$29,641,000 |
| 6926926 |
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias |
Seon-Mee Cho, Hichem M'Saad |
2005-08-09 |
$27,075,000 |
| 6890850 |
Method of depositing dielectric materials in damascene applications |
Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more |
2005-05-10 |
$24,231,000 |
| 6869896 |
Plasma processes for depositing low dielectric constant films |
David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more |
2005-03-22 |
$21,686,000 |
| 6858153 |
Integrated low K dielectrics and etch stops |
Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more |
2005-02-22 |
$18,056,000 |
| 6806207 |
Method of depositing low K films |
Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau +5 more |
2004-10-19 |
$52,625,000 |
| 6803325 |
Apparatus for improving barrier layer adhesion to HDP-FSG thin films |
Hichem M'Saad, Dana Tribula, Manoj Vellaikal, Sameer Desai |
2004-10-12 |
$28,243,000 |
| 6743737 |
Method of improving moisture resistance of low dielectric constant films |
Wai-Fan Yau, David Cheung, Nasreen Chopra, Yung-Cheng Lu, Robert P. Mandal |
2004-06-01 |
$29,854,000 |
