FM

Farhad Moghadam

Applied Materials: 47 patents #175 of 7,310Top 3%
IN Intel: 8 patents #4,870 of 30,777Top 20%
Overall (All Time): #45,838 of 4,157,543Top 2%
55
Patents All Time

Issued Patents All Time

Showing 25 most recent of 55 patents

Patent #TitleCo-InventorsDate
12136537 Cost effective radio frequency impedance matching networks Yue Guo, Kartik Ramaswamy, Yang Yang 2024-11-05
11631583 RF power source operation in plasma enhanced processes Hari Ponnekanti, Dmitry A. Dzilno 2023-04-18
7799698 Deposition-selective etch-deposition process for dielectric film gapfill Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more 2010-09-21
7691753 Deposition-selective etch-deposition process for dielectric film gapfill Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more 2010-04-06
7560377 Plasma processes for depositing low dielectric constant films David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more 2009-07-14
7514353 Contact metallization scheme using a barrier layer over a silicide layer Timothy Weidman, Kapila Wijekoon, Zhize Zhu, Avgerinos V. Gelatos, Amit Khandelwal +3 more 2009-04-07
7431585 Apparatus and method for heating substrates Jun Zhao, David H. Quach, Timothy Weidman, Rick J. Roberts, Dan Maydan 2008-10-07
7399388 Sequential gas flow oxide deposition technique Michael S. Cox, Padmanabhan Krishnaraj, Thanh Pham 2008-07-15
7381052 Apparatus and method for heating substrates Jun Zhao, David H. Quach, Timothy Weidman, Rick J. Roberts, Dan Maydan 2008-06-03
7256139 Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices Jun Zhao, Timothy Weidman, Rick J. Roberts, Li Xia, Alexandros T. Demos 2007-08-14
7227244 Integrated low k dielectrics and etch stops Claes Bjorkman, Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more 2007-06-05
7160821 Method of depositing low k films Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau +5 more 2007-01-09
7151053 Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more 2006-12-19
7097886 Deposition process for high aspect ratio trenches Michael S. Cox, Padmanabhan Krishnaraj, Thanh Pham, Zhenjiang Cui 2006-08-29
7081414 Deposition-selective etch-deposition process for dielectric film gapfill Lin Zhang, Xiaolin Chen, Dongqing Li, Thanh Pham, Zhuang Li +1 more 2006-07-25
6958112 Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation M. Ziaul Karim, Siamak Salimian 2005-10-25
6936551 Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices Jun Zhao, Timothy Weidman, Rick J. Roberts, Li-Qun Xia, Alexandros T. Demos 2005-08-30
6930061 Plasma processes for depositing low dielectric constant films David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more 2005-08-16
6926926 Silicon carbide deposited by high density plasma chemical-vapor deposition with bias Seon-Mee Cho, Hichem M'Saad 2005-08-09
6890850 Method of depositing dielectric materials in damascene applications Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more 2005-05-10
6869896 Plasma processes for depositing low dielectric constant films David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more 2005-03-22
6858153 Integrated low K dielectrics and etch stops Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more 2005-02-22
6806207 Method of depositing low K films Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau +5 more 2004-10-19
6803325 Apparatus for improving barrier layer adhesion to HDP-FSG thin films Hichem M'Saad, Dana Tribula, Manoj Vellaikal, Sameer Desai 2004-10-12
6743737 Method of improving moisture resistance of low dielectric constant films Wai-Fan Yau, David Cheung, Nasreen Chopra, Yung-Cheng Lu, Robert P. Mandal 2004-06-01