Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12006572 | Reactor system including a gas distribution assembly for use with activated species and method of using same | Xing Lin, Peipei Gao, Prajwal Nagaraj, Mingyang Ma, Wentao Wang +3 more | 2024-06-11 |
| 10774423 | Tunable ground planes in plasma chambers | Karthik Janakiraman, Thomas Nowak, Juan Carlos Rocha-Alvarez, Mark Fodor, Dale R. Du Bois +4 more | 2020-09-15 |
| 10094486 | Method and system for supplying a cleaning gas into a process chamber | Ramprakash Sankarakrishnan, Dale R. Du Bois, Ganesh Balasubramanian, Karthik Janakiraman, Juan Carlos Rocha-Alvarez +2 more | 2018-10-09 |
| 9337072 | Apparatus and method for substrate clamping in a plasma chamber | Ganesh Balasubramanian, Amit Kumar BANSAL, Eller Y. Juco, Mohamad A. Ayoub, Hyung Joon Kim +11 more | 2016-05-10 |
| 9206511 | Method and system for supplying a cleaning gas into a process chamber | Ramprakash Sankarakrishnan, Dale R. Du Bois, Ganesh Balasubramanian, Karthik Janakiraman, Juan Carlos Rocha-Alvarez +2 more | 2015-12-08 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more | 2014-06-17 |
| 8591699 | Method and system for supplying a cleaning gas into a process chamber | Ramprakash Sankarakrishnan, Dale R. Du Bois, Ganesh Balasubramanian, Karthik Janakiraman, Juan Carlos Rocha-Alvarez +2 more | 2013-11-26 |
| 8445075 | Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics | Huiwen Xu, Mei-Yee Shek, Li-Qun Xia, Amir Al-Bayati, Derek R. Witty | 2013-05-21 |
| 8389376 | Air gap integration scheme | Alexandros T. Demos, Li-Qun Xia, Bok Hoen Kim, Derek R. Witty | 2013-03-05 |
| 8382885 | Fluid filtration for substrate processing chamber | Dustin W. Ho, Juan Carlos Rocha-Alvarez | 2013-02-26 |
| 8282734 | Methods to improve the in-film defectivity of PECVD amorphous carbon films | Deenesh Padhi, Chiu Chan, Sudha Rathi, Ganesh Balasubramanian, Jianhua Zhou +4 more | 2012-10-09 |
| 8138104 | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure | Mihaela Balseanu, Victor Nguyen, Li-Qun Xia, Derek R. Witty, Mei-Yee Shek +1 more | 2012-03-20 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Mei-Yee Shek, Jia-Sheng Lee +4 more | 2012-03-06 |
| 8084105 | Method of depositing boron nitride and boron nitride-derived materials | Jeong-Uk Huh, Mihaela Balseanu, Li-Qun Xia, Victor Nguyen, Derek R. Witty | 2011-12-27 |
| 8043870 | CMP pad thickness and profile monitoring system | Antoine P. Manens, Wei-Yung Hsu | 2011-10-25 |
| 7964442 | Methods to obtain low k dielectric barrier with superior etch resistivity | Huiwen Xu, Yijun Liu, Li-Qun Xia, Derek R. Witty | 2011-06-21 |
| 7951730 | Decreasing the etch rate of silicon nitride by carbon addition | Ritwik Bhatia, Li-Qun Xia, Chad Peterson | 2011-05-31 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Mei-Yee Shek, Li-Qun Xia | 2011-04-12 |
| 7871926 | Methods and systems for forming at least one dielectric layer | Li-Qun Xia, Mihaela Balseanu, Victor Nguyen, Derek R. Witty, Haichun Yang +3 more | 2011-01-18 |
| 7867578 | Method for depositing an amorphous carbon film with improved density and step coverage | Deenesh Padhi, Hyoung-Chan Ha, Sudha Rathi, Derek R. Witty, Chiu Chan +6 more | 2011-01-11 |
| 7851384 | Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film | Yijun Liu, Huiwen Xu, Li-Qun Xia, Chad Peterson | 2010-12-14 |
| 7802538 | Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors | Deenesh Padhi, Sohyun Park, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Li-Qun Xia +1 more | 2010-09-28 |
| 7790583 | Clean process for an electron beam source | Alexandros T. Demos, Khaled A. Elsheref, Josphine J. Chang | 2010-09-07 |
| 7790635 | Method to increase the compressive stress of PECVD dielectric films | Mihaela Balseanu, Victor Nguyen, Li-Qun Xia, Vladimir Zubkov, Derek R. Witty | 2010-09-07 |
| 7780865 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Li-Qun Xia, Mei-Yee Shek | 2010-08-24 |