Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8910644 | Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas | Hua Chung, Xizi Dong, Kyawwin Jason Maung, Hiroji Hanawa, Sang Won Kang +6 more | 2014-12-16 |
| D664170 | Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass | Hua Chung, Xizi Dong, Kyawwin Jason Maung, Hiroji Hanawa, Sang Won Kang +6 more | 2012-07-24 |
| 8043870 | CMP pad thickness and profile monitoring system | Antoine P. Manens, Hichem M'Saad | 2011-10-25 |
| 8012000 | Extended pad life for ECMP and barrier removal | Yuchun Wang, Robert Ewald, Liang-Yuh Chen | 2011-09-06 |
| 7993485 | Methods and apparatus for processing a substrate | Erik C. Wasinger, Gary C. Ettinger, Sen-Hou Ko, Liang-Yuh Chen, Ho Seon Shin +1 more | 2011-08-09 |
| 7749048 | Polishing pad conditioning process | James C. Wang, Hung K. Nguyen, Sen-Hou Ko | 2010-07-06 |
| 7520795 | Grooved retaining ring | Shi-Ping Wang, Alain Duboust, Antoine P. Manens, Jose Salas-Vernis, Zhihong Wang | 2009-04-21 |
| 7390429 | Method and composition for electrochemical mechanical polishing processing | Feng Q. Liu, Tianbao Du, Alain Duboust | 2008-06-24 |
| 7323095 | Integrated multi-step gap fill and all feature planarization for conductive materials | Liang-Yuh Chen, Ratson Morad, Daniel Carl, Sasson Somekh | 2008-01-29 |
| 7323416 | Method and composition for polishing a substrate | Feng Q. Liu, Tianbao Du, Alain Duboust, Yan Wang, Yongqi Hu +3 more | 2008-01-29 |
| 7244168 | Methods for reducing delamination during chemical mechanical polishing | Yufei Chen, Lizhong Sun, Doohan Lee | 2007-07-17 |
| 7175505 | Method for adjusting substrate processing times in a substrate polishing system | Sen-Hou Ko, Harry Q. Lee | 2007-02-13 |
| 7037174 | Methods for reducing delamination during chemical mechanical polishing | Yufei Chen, Lizhong Sun, Doohan Lee | 2006-05-02 |
| 6911689 | Versatile system for chromium based diffusion barriers in electrode structures | Scott R. Summerfelt, Paul McIntyre | 2005-06-28 |
| 6896776 | Method and apparatus for electro-chemical processing | Liang-Yuh Chen, Ratson Morad, Daniel Carl, Sasson Somekh | 2005-05-24 |
| 6884724 | Method for dishing reduction and feature passivation in polishing processes | Liang-Yuh Chen, Ratson Morad, Daniel Carl | 2005-04-26 |
| 6811470 | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates | Benjamin A. Bonner, Anand N. Iyer, Deepak Kumar, Thomas H. Osterheld, Yong Sik Kim +2 more | 2004-11-02 |
| 6811680 | Planarization of substrates using electrochemical mechanical polishing | Liang-Yuh Chen, Alain Duboust, Ratson Morad, Daniel Carl | 2004-11-02 |
| 6689686 | System and method for electroplating fine geometries | Richard L. Guldi | 2004-02-10 |
| 6680249 | Si-rich surface layer capped diffusion barriers | Jiong-Ping Lu, Qi-Zhong Hong, Richard Allen Faust | 2004-01-20 |
| 6677232 | Method for fabricating metal conductors and multi-level interconnects in a semiconductor device | Qi-Zhong Hong, Vincent T. Cordasco | 2004-01-13 |
| 6677239 | Methods and compositions for chemical mechanical polishing | Gopalakrishna B. Prabhu, Lizhong Sun, Daniel Carl | 2004-01-13 |
| 6660650 | Selective aluminum plug formation and etchback process | Anthony Konecni, Qi-Zhong Hong | 2003-12-09 |
| 6641867 | Methods for chemical vapor deposition of tungsten on silicon or dielectric | Jiong-Ping Lu, August Fischer, Ming-Jang Hwang | 2003-11-04 |
| 6573167 | Using a carbon film as an etch hardmask for hard-to-etch materials | Guoqiang Xing, Changming Jin | 2003-06-03 |