| 10589397 |
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing |
Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson, Boguslaw A. Swedek +4 more |
2020-03-17 |
$17,260,000 |
| 10103288 |
Transfer chamber metrology for improved device yield |
David P. Bour, Alexey Goder |
2018-10-16 |
$21,789,000 |
| 9076827 |
Transfer chamber metrology for improved device yield |
David P. Bour, Alexey Goder |
2015-07-07 |
$12,656,000 |
| 8694144 |
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing |
Stephen Jew, David H. Mai, Huyen Tran, Wen-Chiang Tu, Shih-Haur Shen +4 more |
2014-04-08 |
$11,783,000 |
| 8465342 |
Method of making and apparatus having windowless polishing pad and protected fiber |
Jimin Zhang, Doyle E. Bennett |
2013-06-18 |
$9,611,000 |
| 8157614 |
Method of making and apparatus having windowless polishing pad and protected fiber |
Jimin Zhang, Doyle E. Bennett |
2012-04-17 |
$9,496,000 |
| 8066552 |
Multi-layer polishing pad for low-pressure polishing |
Shou-Sung Chang, Wei Lu, Siew Neo, Yan Wang, Antoine P. Manens +1 more |
2011-11-29 |
$8,648,000 |
| 7842169 |
Method and apparatus for local polishing control |
Stan Tsai, Feng Q. Liu, Yan Wang, Rashid Mavliev, Liang-Yuh Chen |
2010-11-30 |
$5,930,000 |
| 7790015 |
Endpoint for electroprocessing |
Yan Wang, Antoine P. Manens, Siew Neo, Liang-Yuh Chen |
2010-09-07 |
$5,434,000 |
| 7709382 |
Electroprocessing profile control |
Antoine P. Manens, Vladimir Galburt, Yan Wang, Donald Olgado, Liang-Yuh Chen |
2010-05-04 |
$14,487,000 |
| 7678245 |
Method and apparatus for electrochemical mechanical processing |
Yan Wang, Siew Neo, Feng Q. Liu, Stan Tsai, Yongqi Hu +9 more |
2010-03-16 |
$12,179,000 |
| 7655565 |
Electroprocessing profile control |
Antoine P. Manens, Vladimir Galburt, Yan Wang, Donald Olgado, Liang-Yuh Chen |
2010-02-02 |
$9,869,000 |
| 7628905 |
Algorithm for real-time process control of electro-polishing |
Antoine P. Manens, Siew Neo, Liang-Yuh Chen |
2009-12-08 |
$20,724,000 |
| 7608173 |
Biased retaining ring |
Antoine P. Manens, Feng Q. Liu, Paul D. Butterfield, Rashid Mavliev |
2009-10-27 |
$53,033,000 |
| 7520795 |
Grooved retaining ring |
Shi-Ping Wang, Antoine P. Manens, Wei-Yung Hsu, Jose Salas-Vernis, Zhihong Wang |
2009-04-21 |
$9,285,000 |
| 7422516 |
Conductive polishing article for electrochemical mechanical polishing |
Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more |
2008-09-09 |
$16,131,000 |
| 7390429 |
Method and composition for electrochemical mechanical polishing processing |
Feng Q. Liu, Tianbao Du, Wei-Yung Hsu |
2008-06-24 |
$46,686,000 |
| 7344432 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
Liang-Yun Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +9 more |
2008-03-18 |
$36,315,000 |
| 7323416 |
Method and composition for polishing a substrate |
Feng Q. Liu, Tianbao Du, Yan Wang, Yongqi Hu, Stan Tsai +3 more |
2008-01-29 |
$14,525,000 |
| 7311592 |
Conductive polishing article for electrochemical mechanical polishing |
Liang-Yuh Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +4 more |
2007-12-25 |
|
| 7303462 |
Edge bead removal by an electro polishing process |
Antoine P. Manens, Liang-Yuh Chen |
2007-12-04 |
$27,736,000 |
| 7285036 |
Pad assembly for electrochemical mechanical polishing |
Shou-Sung Chang, Stan Tsai, Donald Olgado, Liang-Yuh Chen, Ralph Wadensweiler |
2007-10-23 |
$18,419,000 |
| 7278911 |
Conductive polishing article for electrochemical mechanical polishing |
Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more |
2007-10-09 |
$22,463,000 |
| 7276743 |
Retaining ring with conductive portion |
Antoine P. Manens, Suresh Shrauti, Yan Wang, Liang-Yuh Chen |
2007-10-02 |
$69,542,000 |
| 7232514 |
Method and composition for polishing a substrate |
Feng Q. Liu, Stan Tsai, Yongqi Hu, Siew Neo, Yan Wang +1 more |
2007-06-19 |
$24,732,000 |
