Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10589397 | Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing | Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson, Boguslaw A. Swedek +4 more | 2020-03-17 |
| 10103288 | Transfer chamber metrology for improved device yield | David P. Bour, Alexey Goder | 2018-10-16 |
| 9076827 | Transfer chamber metrology for improved device yield | David P. Bour, Alexey Goder | 2015-07-07 |
| 8694144 | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing | Stephen Jew, David H. Mai, Huyen Tran, Wen-Chiang Tu, Shih-Haur Shen +4 more | 2014-04-08 |
| 8465342 | Method of making and apparatus having windowless polishing pad and protected fiber | Jimin Zhang, Doyle E. Bennett | 2013-06-18 |
| 8157614 | Method of making and apparatus having windowless polishing pad and protected fiber | Jimin Zhang, Doyle E. Bennett | 2012-04-17 |
| 8066552 | Multi-layer polishing pad for low-pressure polishing | Shou-Sung Chang, Wei Lu, Siew Neo, Yan Wang, Antoine P. Manens +1 more | 2011-11-29 |
| 7842169 | Method and apparatus for local polishing control | Stan Tsai, Feng Q. Liu, Yan Wang, Rashid Mavliev, Liang-Yuh Chen | 2010-11-30 |
| 7790015 | Endpoint for electroprocessing | Yan Wang, Antoine P. Manens, Siew Neo, Liang-Yuh Chen | 2010-09-07 |
| 7709382 | Electroprocessing profile control | Antoine P. Manens, Vladimir Galburt, Yan Wang, Donald Olgado, Liang-Yuh Chen | 2010-05-04 |
| 7678245 | Method and apparatus for electrochemical mechanical processing | Yan Wang, Siew Neo, Feng Q. Liu, Stan Tsai, Yongqi Hu +9 more | 2010-03-16 |
| 7655565 | Electroprocessing profile control | Antoine P. Manens, Vladimir Galburt, Yan Wang, Donald Olgado, Liang-Yuh Chen | 2010-02-02 |
| 7628905 | Algorithm for real-time process control of electro-polishing | Antoine P. Manens, Siew Neo, Liang-Yuh Chen | 2009-12-08 |
| 7608173 | Biased retaining ring | Antoine P. Manens, Feng Q. Liu, Paul D. Butterfield, Rashid Mavliev | 2009-10-27 |
| 7520795 | Grooved retaining ring | Shi-Ping Wang, Antoine P. Manens, Wei-Yung Hsu, Jose Salas-Vernis, Zhihong Wang | 2009-04-21 |
| 7422516 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2008-09-09 |
| 7390429 | Method and composition for electrochemical mechanical polishing processing | Feng Q. Liu, Tianbao Du, Wei-Yung Hsu | 2008-06-24 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | Liang-Yun Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +9 more | 2008-03-18 |
| 7323416 | Method and composition for polishing a substrate | Feng Q. Liu, Tianbao Du, Yan Wang, Yongqi Hu, Stan Tsai +3 more | 2008-01-29 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +4 more | 2007-12-25 |
| 7303462 | Edge bead removal by an electro polishing process | Antoine P. Manens, Liang-Yuh Chen | 2007-12-04 |
| 7285036 | Pad assembly for electrochemical mechanical polishing | Shou-Sung Chang, Stan Tsai, Donald Olgado, Liang-Yuh Chen, Ralph Wadensweiler | 2007-10-23 |
| 7278911 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2007-10-09 |
| 7276743 | Retaining ring with conductive portion | Antoine P. Manens, Suresh Shrauti, Yan Wang, Liang-Yuh Chen | 2007-10-02 |
| 7232514 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Yongqi Hu, Siew Neo, Yan Wang +1 more | 2007-06-19 |