Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12320883 | Resistivity-based adjustment of thresholds for in-situ monitoring | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu | 2025-06-03 |
| 11199605 | Resistivity-based adjustment of measurements from in-situ monitoring | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu | 2021-12-14 |
| 11079459 | Resistivity-based calibration of in-situ electromagnetic inductive monitoring | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu | 2021-08-03 |
| 10741459 | Inductive monitoring of conductive loops | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2020-08-11 |
| 10589397 | Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing | Alain Duboust, Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Boguslaw A. Swedek +4 more | 2020-03-17 |
| 10556315 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2020-02-11 |
| 10427272 | Endpoint detection with compensation for filtering | Kun Xu, Kevin Y. Lin, Shih-Haur Shen, Tzu-Yu Liu | 2019-10-01 |
| 10207386 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2019-02-19 |
| 10103073 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2018-10-16 |
| 9754846 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2017-09-05 |
| 9636797 | Adjusting eddy current measurements | Kun Xu, Boguslaw A. Swedek, Doyle E. Bennett, Shih-Haur Shen, Hassan G. Iravani +2 more | 2017-05-02 |
| 9472475 | Feedback control using detection of clearance and adjustment for uniform topography | Kun Xu, Tzu-Yu Liu, Shih-Haur Shen, Boguslaw A. Swedek, Wen-Chiang Tu +1 more | 2016-10-18 |
| 9281253 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2016-03-08 |
| 9275917 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2016-03-01 |
| 9205527 | In-situ monitoring system with monitoring of elongated region | Kun Xu, Shih-Haur Shen, Tzu-Yu Liu, Hassan G. Iravani, Boguslaw A. Swedek +2 more | 2015-12-08 |
| 9073169 | Feedback control of polishing using optical detection of clearance | Kun Xu, Feng Q. Liu, David Maxwell Gage, You Wang, Dominic J. Benvegnu +5 more | 2015-07-07 |
| 9023667 | High sensitivity eddy current monitoring system | Hassan G. Iravani, Kun Xu, Boguslaw A. Swedek, Shih-Haur Shen, Wen-Chiang Tu | 2015-05-05 |
| 8694144 | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing | Alain Duboust, Stephen Jew, David H. Mai, Huyen Tran, Wen-Chiang Tu +4 more | 2014-04-08 |
| 8616935 | Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing | Jimin Zhang, Stephen Jew, Boguslaw A. Swedek | 2013-12-31 |
| 8295967 | Endpoint control of multiple-wafer chemical mechanical polishing | Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek, Stephen Jew | 2012-10-23 |
| 8284560 | Eddy current sensor with enhanced edge resolution | Hassan G. Iravani, Boguslaw A. Swedek | 2012-10-09 |
| 8014004 | Determining physical property of substrate | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Dominic J. Benvegnu +2 more | 2011-09-06 |
| 7952708 | High throughput measurement system | Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian +3 more | 2011-05-31 |
| 7840375 | Methods and apparatus for generating a library of spectra | Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian +3 more | 2010-11-23 |
| 7746485 | Determining physical property of substrate | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Dominic J. Benvegnu +2 more | 2010-06-29 |