Issued Patents All Time
Showing 25 most recent of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12229945 | Wafer bin map based root cause analysis | Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Michael Keleher | 2025-02-18 |
| 12038802 | Collaborative learning model for semiconductor applications | Tomonori Honda, Richard Burch, John Kibarian, Lin Lee Cheong, Qing Zhu +6 more | 2024-07-16 |
| 11972552 | Abnormal wafer image classification | Tomonori Honda, Richard Burch, Qing Zhu | 2024-04-30 |
| 11774235 | Grouping spectral data from polishing substrates | Boguslaw A. Swedek | 2023-10-03 |
| 11763446 | Wafer bin map based root cause analysis | Tomonori Honda, Lin Lee Cheong, Richard Burch, Qing Zhu, Michael Keleher | 2023-09-19 |
| 11715672 | Endpoint detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Boguslaw A. Swedek | 2023-08-01 |
| 11609812 | Anomalous equipment trace detection and classification | Richard Burch, Qing Zhu, Tomonori Honda, Lin Lee Cheong | 2023-03-21 |
| 11295993 | Maintenance scheduling for semiconductor manufacturing equipment | Tomonori Honda, Lin Lee Cheong | 2022-04-05 |
| 11183435 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Boguslaw A. Swedek | 2021-11-23 |
| 11029673 | Generating robust machine learning predictions for semiconductor manufacturing processes | Tomonori Honda, Rohan D. Kekatpure | 2021-06-08 |
| 11022642 | Semiconductor yield prediction | Tomonori Honda, Lin Lee Cheong | 2021-06-01 |
| 10948900 | Display of spectra contour plots versus time for semiconductor processing system control | Harry Q. Lee, Dominic J. Benvegnu, Boguslaw A. Swedek | 2021-03-16 |
| 10777470 | Selective inclusion/exclusion of semiconductor chips in accelerated failure tests | Lin Lee Cheong, Tomonori Honda, Rohan D. Kekatpure, Lakshmikar Kuravi | 2020-09-15 |
| 10766119 | Spectra based endpointing for chemical mechanical polishing | Boguslaw A. Swedek, Dominic J. Benvegnu | 2020-09-08 |
| 10734293 | Process control techniques for semiconductor manufacturing processes | — | 2020-08-04 |
| 10651098 | Polishing with measurement prior to deposition of outer layer | Tomohiko Kitajima, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey | 2020-05-12 |
| 10430719 | Process control techniques for semiconductor manufacturing processes | — | 2019-10-01 |
| 10276460 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Boguslaw A. Swedek | 2019-04-30 |
| 10086492 | Applying dimensional reduction to spectral data from polishing substrates | Boguslaw A. Swedek, Benjamin Cherian | 2018-10-02 |
| 10012494 | Grouping spectral data from polishing substrates | Boguslaw A. Swedek | 2018-07-03 |
| 9886026 | Endpoint method using peak location of spectra contour plots versus time | Harry Q. Lee, Dominic J. Benvegnu, Boguslaw A. Swedek | 2018-02-06 |
| 9833874 | Applying dimensional reduction to spectral data from polishing substrates | Boguslaw A. Swedek, Benjamin Cherian | 2017-12-05 |
| 9811077 | Polishing with pre deposition spectrum | Tomohiko Kitajima, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey | 2017-11-07 |
| 9649743 | Dynamically tracking spectrum features for endpoint detection | Harry Q. Lee | 2017-05-16 |
| 9583405 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Boguslaw A. Swedek | 2017-02-28 |