BC

Benjamin Cherian

Applied Materials: 44 patents #196 of 7,310Top 3%
Overall (All Time): #66,711 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 25 most recent of 44 patents

Patent #TitleCo-InventorsDate
12420373 Control of processing parameters during substrate polishing using cost function Sivakumar Dhandapani 2025-09-23
12403560 Determining substrate precession with acoustic signals Nicholas A. Wiswell, Jun Qian, Thomas H. Osterheld 2025-09-02
12343840 Control of processing parameters for substrate polishing with substrate precession Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Brian J. Brown +1 more 2025-07-01
12311494 Pressure signals during motor torque monitoring to provide spatial resolution Thomas Li 2025-05-27
12257665 Machine vision as input to a CMP process control algorithm Jun Qian, Nicholas A. Wiswell, Dominic J. Benvegnu, Boguslaw A. Swedek, Thomas H. Osterheld 2025-03-25
12148149 Training a machine learning system to detect an excursion of a CMP component using time-based sequence of images Sidney P. Huey, Thomas Li 2024-11-19
12136574 Technique for training neural network for use in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more 2024-11-05
12090599 Determination of substrate layer thickness with polishing pad wear compensation Kun Xu, Jun Qian, Kiran Shrestha 2024-09-17
12079984 Detecting an excursion of a CMP component using time-based sequence of images Sidney P. Huey, Thomas Li 2024-09-03
12057354 Trained neural network in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more 2024-08-06
12020159 Training spectrum generation for machine learning system for spectrographic monitoring Nicholas A. Wiswell, Jun Qian, Thomas H. Osterheld 2024-06-25
11969854 Control of processing parameters during substrate polishing using expected future parameter changes Sivakumar Dhandapani 2024-04-30
11966212 Spectrographic monitoring using a neural network 2024-04-23
11931853 Control of processing parameters for substrate polishing with angularly distributed zones using cost function Eric Lau, Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Brian J. Brown +1 more 2024-03-19
11919121 Control of processing parameters during substrate polishing using constrained cost function Sivakumar Dhandapani 2024-03-05
11865664 Profile control with multiple instances of contol algorithm during polishing Kun Xu, Harry Q. Lee, David Maxwell Gage 2024-01-09
11865671 Temperature-based in-situ edge assymetry correction during CMP Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen +1 more 2024-01-09
11850699 Switching control algorithms on detection of exposure of underlying layer during polishing Kun Xu, Harry Q. Lee, David Maxwell Gage 2023-12-26
11791224 Technique for training neural network for use in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more 2023-10-17
11780047 Determination of substrate layer thickness with polishing pad wear compensation Kun Xu, Jun Qian, Kiran Shrestha 2023-10-10
11731238 Monitoring of polishing pad texture in chemical mechanical polishing Thomas H. Osterheld 2023-08-22
11733686 Machine learning systems for monitoring of semiconductor processing Graham Yennie 2023-08-22
11710228 Detecting an excursion of a CMP component using time-based sequence of images and machine learning Sidney P. Huey, Thomas Li 2023-07-25
11697187 Temperature-based assymetry correction during CMP and nozzle for media dispensing Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung, Hui Chen +1 more 2023-07-11
11658078 Using a trained neural network for use in in-situ monitoring during polishing and polishing system Kun Xu, Kiran Shrestha, Doyle E. Bennett, David Maxwell Gage, Jun Qian +1 more 2023-05-23