Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12343840 | Control of processing parameters for substrate polishing with substrate precession | Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Benjamin Cherian, Brian J. Brown +1 more | 2025-07-01 |
| 11931853 | Control of processing parameters for substrate polishing with angularly distributed zones using cost function | Charles C. Garretson, Huanbo Zhang, Zhize Zhu, Benjamin Cherian, Brian J. Brown +1 more | 2024-03-19 |
| 11869815 | Asymmetry correction via oriented wafer loading | Charles C. Garretson, Huanbo Zhang, Zhize Zhu | 2024-01-09 |
| 11764069 | Asymmetry correction via variable relative velocity of a wafer | Jimin Zhang, Brian J. Brown, Ekaterina A. Mikhaylichenko, Jeonghoon Oh, Gerald Alonzo | 2023-09-19 |
| 11400560 | Retaining ring design | Jeonghoon Oh, Charles C. Garretson, Andrew J. Nagengast, Steven M. Zuniga, Edwin C. Suarez +2 more | 2022-08-02 |
| 11282755 | Asymmetry correction via oriented wafer loading | Charles C. Garretson, Huanbo Zhang, Zhize Zhu | 2022-03-22 |
| 10610994 | Polishing system with local area rate control and oscillation mode | Hui Chen, King Yi Heung, Chih Chung Chou, Edwin C. Suarez, Garrett H. Sin +2 more | 2020-04-07 |
| 10589399 | Textured small pad for chemical mechanical polishing | Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, King Yi Heung, Ashwin CHOCKALINGAM +3 more | 2020-03-17 |
| 10434623 | Local area polishing system and polishing pad assemblies for a polishing system | Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou, Edwin C. Suarez +3 more | 2019-10-08 |
| 10256111 | Chemical mechanical polishing automated recipe generation | King Yi Heung, Charles C. Garretson, Jun Qian, Thomas H. Osterheld, Shuchivrat Datar +1 more | 2019-04-09 |
| 10076817 | Orbital polishing with small pad | Hung Chih Chen, Paul D. Butterfield, Jay Gurusamy, Jason Garcheung Fung, Shou-Sung Chang +1 more | 2018-09-18 |
| 9873179 | Carrier for small pad for chemical mechanical polishing | Hui Chen, Steven M. Zuniga, Hung Chih Chen, Garrett H. Sin, Shou-Sung Chang | 2018-01-23 |