SC

Shou-Sung Chang

Applied Materials: 57 patents #130 of 7,310Top 2%
AP Aplex: 5 patents #2 of 32Top 7%
MV Mosel Vitelic: 2 patents #107 of 482Top 25%
Overall (All Time): #34,205 of 4,157,543Top 1%
64
Patents All Time

Issued Patents All Time

Showing 25 most recent of 64 patents

Patent #TitleCo-InventorsDate
12392427 Insulated fluid lines in chemical mechanical polishing Chad Pollard, Hari Soundararajan, Paul D. Butterfield, Haosheng Wu, Calvin Spencer Lee +1 more 2025-08-19
12318882 Apparatus and method for CMP temperature control Hari Soundararajan, Haosheng Wu, Jianshe Tang 2025-06-03
12296427 Apparatus and method for CMP temperature control Haosheng Wu, Chih Chung Chou, Jianshe Tang, Hui Chen, Hari Soundararajan +1 more 2025-05-13
12290896 Apparatus and method for CMP temperature control Hari Soundararajan, Haosheng Wu, Jianshe Tang 2025-05-06
12290897 Fluid-tight electrical connection techniques for semiconductor processing Chad Pollard, Haosheng Wu 2025-05-06
12214468 Temperature control of chemical mechanical polishing Haosheng Wu, Hari Soundararajan, Yen-Chu Yang, Jianshe Tang, Shih-Haur Shen +1 more 2025-02-04
12106976 Steam-assisted single substrate cleaning process and apparatus Jianshe Tang, Wei Lu, Haosheng Wu, Taketo Sekine, Hari Soundararajan +1 more 2024-10-01
12030093 Steam treatment stations for chemical mechanical polishing system Haosheng Wu, Jianshe Tang, Hari Soundararajan, Hui Chen, Chih Chung Chou +2 more 2024-07-09
11986926 Slurry distribution device for chemical mechanical polishing Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Paul D. Butterfield +2 more 2024-05-21
11919123 Apparatus and method for CMP temperature control Surajit Kumar, Hari Soundararajan, Hui Chen 2024-03-05
11897079 Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity Haosheng Wu, Hari Soundararajan, Jianshe Tang, Brian J. Brown, Yen-Chu Yang +2 more 2024-02-13
11865671 Temperature-based in-situ edge assymetry correction during CMP Haosheng Wu, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan +1 more 2024-01-09
11833637 Control of steam generation for chemical mechanical polishing Hari Soundararajan, Calvin Spencer Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar +3 more 2023-12-05
11826872 Temperature and slurry flow rate control in CMP Haosheng Wu, Jianshe Tang, Brian J. Brown, Shih-Haur Shen, Hari Soundararajan 2023-11-28
11819976 Spray system for slurry reduction during chemical mechanical polishing (cmp) Chih Chung Chou, Anand N. Iyer, Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Erik S. Rondum +1 more 2023-11-21
11806835 Slurry distribution device for chemical mechanical polishing Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Paul D. Butterfield +2 more 2023-11-07
11780046 Polishing system with annular platen or polishing pad Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Steven M. Zuniga, Fred C. Redeker 2023-10-10
11752589 Chemical mechanical polishing temperature scanning apparatus for temperature control Hari Soundararajan, Haosheng Wu, Jianshe Tang 2023-09-12
11728185 Steam-assisted single substrate cleaning process and apparatus Jianshe Tang, Wei Lu, Haosheng Wu, Taketo Sekine, Hari Soundararajan +1 more 2023-08-15
11697187 Temperature-based assymetry correction during CMP and nozzle for media dispensing Haosheng Wu, Jianshe Tang, Chih Chung, Hui Chen, Hari Soundararajan +1 more 2023-07-11
11633833 Use of steam for pre-heating of CMP components Haosheng Wu, Jianshe Tang, Hari Soundararajan, Paul D. Butterfield, Hui Chen +2 more 2023-04-25
11628478 Steam cleaning of CMP components Haosheng Wu, Jianshe Tang, Hari Soundararajan, Hui Chen, Chih Chung Chou +2 more 2023-04-18
11597052 Temperature control of chemical mechanical polishing Hari Soundararajan, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj +1 more 2023-03-07
11577358 Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing Surajit Kumar, Hui Chen, Chih Chung Chou 2023-02-14
11511388 Polishing system with support post and annular platen or polishing pad Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Steven M. Zuniga, Fred C. Redeker 2022-11-29