Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11819976 | Spray system for slurry reduction during chemical mechanical polishing (cmp) | Chih Chung Chou, Anand N. Iyer, Ekaterina A. Mikhaylichenko, Erik S. Rondum, Tiffany Yu-Nung Cheung +1 more | 2023-11-21 |
| 11794305 | Platen surface modification and high-performance pad conditioning to improve CMP performance | Anand N. Iyer, Hyuen Karen Tran, Ghunbong Cheung | 2023-10-24 |
| 11673226 | Retaining ring for CMP | Andrew J. Nagengast, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang +3 more | 2023-06-13 |
| 10350728 | System and process for in situ byproduct removal and platen cooling during CMP | Jie Diao, Erik S. Rondum, Thomas Li, Bum Jick Kim | 2019-07-16 |
| 10322492 | Retaining ring for CMP | Andrew J. Nagengast, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang +3 more | 2019-06-18 |
| 9498866 | Polishing pad cleaning with vacuum apparatus | Thomas Li, Tianyu Yang | 2016-11-22 |
| 8439723 | Chemical mechanical polisher with heater and method | Robert A. Marks, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum | 2013-05-14 |
| 8211325 | Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications | Jie Diao, Garlen C. Leung, Lakshmanan Karuppiah | 2012-07-03 |
| 7086933 | Flexible polishing fluid delivery system | Lidia Vereen, Peter Skarpelos, Brian Downum, Patrick A. Williams, Terry Kin Ting Ko +3 more | 2006-08-08 |
| 7063597 | Polishing processes for shallow trench isolation substrates | Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam Zhong, Peter McReynolds +3 more | 2006-06-20 |