Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11819976 | Spray system for slurry reduction during chemical mechanical polishing (cmp) | Chih Chung Chou, Anand N. Iyer, Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Erik S. Rondum +1 more | 2023-11-21 |