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Spray system for slurry reduction during chemical mechanical polishing (cmp) |
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Platen surface modification and high-performance pad conditioning to improve CMP performance |
Christopher Heung-Gyun Lee, Hyuen Karen Tran, Ghunbong Cheung |
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Retaining ring for CMP |
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Retaining ring for CMP |
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Polishing article with integrated window stripe |
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2010-11-30 |
| 7601050 |
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Polishing article with integrated window stripe |
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Materials for chemical mechanical polishing |
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Materials for chemical mechanical polishing |
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Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
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Method and etchant to join ag-clad BSSCO superconducting tape |
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