AI

Anand N. Iyer

Applied Materials: 10 patents #1,290 of 7,310Top 20%
TC The University Of Chicago: 1 patents #530 of 1,377Top 40%
📍 Cupertino, CA: #1,471 of 6,989 inventorsTop 25%
🗺 California: #55,401 of 386,348 inventorsTop 15%
Overall (All Time): #447,818 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
11819976 Spray system for slurry reduction during chemical mechanical polishing (cmp) Chih Chung Chou, Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Erik S. Rondum, Tiffany Yu-Nung Cheung +1 more 2023-11-21
11794305 Platen surface modification and high-performance pad conditioning to improve CMP performance Christopher Heung-Gyun Lee, Hyuen Karen Tran, Ghunbong Cheung 2023-10-24
11673226 Retaining ring for CMP Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Jie Diao, Huanbo Zhang +3 more 2023-06-13
10322492 Retaining ring for CMP Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Jie Diao, Huanbo Zhang +3 more 2019-06-18
7841925 Polishing article with integrated window stripe Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Gopalakrishna B. Prabhu, Garlen C. Leung 2010-11-30
7601050 Polishing apparatus with grooved subpad Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au +3 more 2009-10-13
7553214 Polishing article with integrated window stripe Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Gopalakrishna B. Prabhu, Garlen C. Leung 2009-06-30
7429210 Materials for chemical mechanical polishing Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more 2008-09-30
7179159 Materials for chemical mechanical polishing Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more 2007-02-20
6811470 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates Benjamin A. Bonner, Deepak Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong Sik Kim +2 more 2004-11-02
5882536 Method and etchant to join ag-clad BSSCO superconducting tape Uthamalingam Balachandran, Jiann Yuan Huang 1999-03-16