Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153486 | CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications | Reza Arghavani, Jeffrey Marks | 2015-10-06 |
| 7601050 | Polishing apparatus with grooved subpad | Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Henry H. Au, Gregory E. Menk +3 more | 2009-10-13 |
| 7429210 | Materials for chemical mechanical polishing | Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more | 2008-09-30 |
| 7179159 | Materials for chemical mechanical polishing | Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum +2 more | 2007-02-20 |
| 6855043 | Carrier head with a modified flexible membrane | Jianshe Tang, Brian J. Brown, Charles C. Garretson, Thomas H. Osterheld, Fred C. Redeker | 2005-02-15 |
| 6834777 | Closed loop control over delivery of liquid material to semiconductor processing tool | Thomas H. Osterheld, Michael W. Richter | 2004-12-28 |
| 6811470 | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates | Anand N. Iyer, Deepak Kumar, Thomas H. Osterheld, Wei-Yung Hsu, Yong Sik Kim +2 more | 2004-11-02 |
| 6561381 | Closed loop control over delivery of liquid material to semiconductor processing tool | Thomas H. Osterheld, Michael W. Richter | 2003-05-13 |
| 6361405 | Utility wafer for chemical mechanical polishing | Jeffrey Drue David, Thomas H. Osterheld, Sidney P. Huey | 2002-03-26 |
| 6251001 | Substrate polishing with reduced contamination | Jay D. Pinson, II, Brian J. Brown, Thomas H. Osterheld, Doyle E. Bennett, Nitin Shah +1 more | 2001-06-26 |
| 6220941 | Method of post CMP defect stability improvement | Boris Fishkin, Charles C. Garretson, Peter McKeever, Thomas H. Osterheld, Gopalakrishna B. Prabhu +2 more | 2001-04-24 |