Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400881 | Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning | Wei Lu, Jimin Zhang, Brian J. Brown | 2025-08-26 |
| 12318882 | Apparatus and method for CMP temperature control | Shou-Sung Chang, Hari Soundararajan, Haosheng Wu | 2025-06-03 |
| 12296427 | Apparatus and method for CMP temperature control | Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Hui Chen, Hari Soundararajan +1 more | 2025-05-13 |
| 12290896 | Apparatus and method for CMP temperature control | Shou-Sung Chang, Hari Soundararajan, Haosheng Wu | 2025-05-06 |
| 12285838 | Wafer edge asymmetry correction using groove in polishing pad | Jimin Zhang, Brian J. Brown, Wei Lu, Priscilla Diep LaRosa | 2025-04-29 |
| 12214468 | Temperature control of chemical mechanical polishing | Haosheng Wu, Hari Soundararajan, Yen-Chu Yang, Shou-Sung Chang, Shih-Haur Shen +1 more | 2025-02-04 |
| 12106976 | Steam-assisted single substrate cleaning process and apparatus | Wei Lu, Haosheng Wu, Taketo Sekine, Shou-Sung Chang, Hari Soundararajan +1 more | 2024-10-01 |
| 12030093 | Steam treatment stations for chemical mechanical polishing system | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou +2 more | 2024-07-09 |
| 11986926 | Slurry distribution device for chemical mechanical polishing | Yen-Chu Yang, Stephen Jew, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield +2 more | 2024-05-21 |
| 11951589 | Wafer edge asymmetry correction using groove in polishing pad | Jimin Zhang, Brian J. Brown, Wei Lu, Priscilla Diep | 2024-04-09 |
| 11948885 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Rong Tao, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli +3 more | 2024-04-02 |
| 11931854 | Chemical mechanical polishing using time share control | Jimin Zhang, Brian J. Brown, Wei Lu, Priscilla Diep LaRosa | 2024-03-19 |
| 11897079 | Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang +2 more | 2024-02-13 |
| 11865671 | Temperature-based in-situ edge assymetry correction during CMP | Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Hui Chen, Hari Soundararajan +1 more | 2024-01-09 |
| 11826872 | Temperature and slurry flow rate control in CMP | Haosheng Wu, Brian J. Brown, Shih-Haur Shen, Shou-Sung Chang, Hari Soundararajan | 2023-11-28 |
| 11823916 | Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning | Wei Lu, Jimin Zhang, Brian J. Brown | 2023-11-21 |
| 11806835 | Slurry distribution device for chemical mechanical polishing | Yen-Chu Yang, Stephen Jew, Haosheng Wu, Shou-Sung Chang, Paul D. Butterfield +2 more | 2023-11-07 |
| 11787008 | Chemical mechanical polishing with applied magnetic field | Xingfeng Wang, Feng Q. Liu, David Maxwell Gage, Stephen Jew | 2023-10-17 |
| 11752589 | Chemical mechanical polishing temperature scanning apparatus for temperature control | Hari Soundararajan, Shou-Sung Chang, Haosheng Wu | 2023-09-12 |
| 11728185 | Steam-assisted single substrate cleaning process and apparatus | Wei Lu, Haosheng Wu, Taketo Sekine, Shou-Sung Chang, Hari Soundararajan +1 more | 2023-08-15 |
| 11697187 | Temperature-based assymetry correction during CMP and nozzle for media dispensing | Haosheng Wu, Shou-Sung Chang, Chih Chung, Hui Chen, Hari Soundararajan +1 more | 2023-07-11 |
| 11633833 | Use of steam for pre-heating of CMP components | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Paul D. Butterfield, Hui Chen +2 more | 2023-04-25 |
| 11628478 | Steam cleaning of CMP components | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou +2 more | 2023-04-18 |
| 11597052 | Temperature control of chemical mechanical polishing | Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jeonghoon Oh, Rajeev Bajaj +1 more | 2023-03-07 |
| 11446711 | Steam treatment stations for chemical mechanical polishing system | Haosheng Wu, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou +2 more | 2022-09-20 |