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Slurry distribution device for chemical mechanical polishing |
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Slurry distribution device for chemical mechanical polishing |
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Chemical mechanical polishing with applied magnetic field |
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Slurry distribution device for chemical mechanical polishing |
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| 10967483 |
Slurry distribution device for chemical mechanical polishing |
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Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing |
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Temperature control of chemical mechanical polishing |
Kun Xu, Jimin Zhang, David H. Mai, Shih-Haur Shen, Zhihong Wang +4 more |
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| 8694144 |
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing |
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Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing |
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| 8292691 |
Use of pad conditioning in temperature controlled CMP |
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2012-10-23 |
| 8295967 |
Endpoint control of multiple-wafer chemical mechanical polishing |
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| 8021211 |
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Wafer polishing device with movable window |
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