WT

Wen-Chiang Tu

Applied Materials: 37 patents #265 of 7,310Top 4%
Lam Research: 2 patents #1,015 of 2,128Top 50%
Overall (All Time): #82,833 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 1–25 of 39 patents

Patent #TitleCo-InventorsDate
10741459 Inductive monitoring of conductive loops Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more 2020-08-11
10589397 Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing Alain Duboust, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson, Boguslaw A. Swedek +4 more 2020-03-17
10556315 Determination of gain for eddy current sensor Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett +2 more 2020-02-11
10464184 Modifying substrate thickness profiles Jimin Zhang, Zhihong Wang 2019-11-05
10207386 Determination of gain for eddy current sensor Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett +2 more 2019-02-19
10199281 Substrate features for inductive monitoring of conductive trench depth Wei Lu, Zhihong Wang, Zhefu Wang, Hassan G. Iravani, Boguslaw A. Swedek +2 more 2019-02-05
10103073 Inductive monitoring of conductive trench depth Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more 2018-10-16
9911664 Substrate features for inductive monitoring of conductive trench depth Wei Lu, Zhihong Wang, Zhefu Wang, Hassan G. Iravani, Boguslaw A. Swedek +2 more 2018-03-06
9754846 Inductive monitoring of conductive trench depth Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more 2017-09-05
9636797 Adjusting eddy current measurements Kun Xu, Ingemar Carlsson, Boguslaw A. Swedek, Doyle E. Bennett, Shih-Haur Shen +2 more 2017-05-02
9496190 Feedback of layer thickness timing and clearance timing for polishing control Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Boguslaw A. Swedek, Yuchun Wang +1 more 2016-11-15
9472475 Feedback control using detection of clearance and adjustment for uniform topography Kun Xu, Ingemar Carlsson, Tzu-Yu Liu, Shih-Haur Shen, Boguslaw A. Swedek +1 more 2016-10-18
9296084 Polishing control using weighting with default sequence Jimin Zhang, Zhihong Wang, Harry Q. Lee 2016-03-29
9281253 Determination of gain for eddy current sensor Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett +2 more 2016-03-08
9275917 Determination of gain for eddy current sensor Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett +2 more 2016-03-01
9248544 Endpoint detection during polishing using integrated differential intensity Jimin Zhang, Harry Q. Lee, Zhihong Wang 2016-02-02
9205527 In-situ monitoring system with monitoring of elongated region Kun Xu, Shih-Haur Shen, Tzu-Yu Liu, Ingemar Carlsson, Hassan G. Iravani +2 more 2015-12-08
9186774 X-ray metrology for control of polishing Boguslaw A. Swedek, Dominic J. Benvegnu 2015-11-17
9073169 Feedback control of polishing using optical detection of clearance Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, You Wang +5 more 2015-07-07
9067295 Monitoring retaining ring thickness and pressure control Sameer Deshpande, Zhihong Wang, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Hung Chih Chen 2015-06-30
9023667 High sensitivity eddy current monitoring system Hassan G. Iravani, Kun Xu, Boguslaw A. Swedek, Ingemar Carlsson, Shih-Haur Shen 2015-05-05
9005999 Temperature control of chemical mechanical polishing Kun Xu, Jimin Zhang, David H. Mai, Stephen Jew, Shih-Haur Shen +4 more 2015-04-14
8989890 GST film thickness monitoring Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Boguslaw A. Swedek, Yuchun Wang +1 more 2015-03-24
8860932 Detection of layer clearing using spectral monitoring Jimin Zhang, Zhihong Wang, Harry Q. Lee 2014-10-14
8694144 Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing Alain Duboust, Stephen Jew, David H. Mai, Huyen Tran, Shih-Haur Shen +4 more 2014-04-08