| 11911870 |
Polishing pads for high temperature processing |
Sivapackia Ganapathiappan, Rajeev Bajaj, Yingdong Luo, Aniruddh Jagdish Khanna, Daniel Redfield |
2024-02-27 |
$57,915,000 |
| 11897079 |
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity |
Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown +2 more |
2024-02-13 |
$47,589,000 |
| 11211252 |
Systems and methods for copper (I) suppression in electrochemical deposition |
Eric J. Bergman, John L. Klocke |
2021-12-28 |
$93,125,000 |
| 11060930 |
Glass surface stress meter and multiple-tempered glass surface stress meter |
Xiuxin Shang, Xudong Wang, Xiupu Wang, Fei Yan, XIANG-BIAO TANG |
2021-07-13 |
|
| 10786885 |
Thin plastic polishing article for CMP applications |
Robert D. Tolles, Gregory E. Menk, Eric Davey, Huyen Karen Tran, Fred C. Redeker +3 more |
2020-09-29 |
$24,138,000 |
| 9073169 |
Feedback control of polishing using optical detection of clearance |
Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, Dominic J. Benvegnu +5 more |
2015-07-07 |
$12,656,000 |
| 8586481 |
Chemical planarization of copper wafer polishing |
Wen-Chiang Tu, Feng Q. Liu, Yuchun Wang, Lakshmanan Karuppiah, William H. McClintock +1 more |
2013-11-19 |
$10,370,000 |
| 8210900 |
Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery |
Wen-Chiang Tu, Yuchun Wang, Lakshmanan Karuppiah |
2012-07-03 |
$11,712,000 |
| 7879255 |
Method and composition for electrochemically polishing a conductive material on a substrate |
Huyen Karen Tran, Renhe Jia, Stan Tsai, Martin S. Wohlert, Daxin Mao |
2011-02-01 |
$7,897,000 |
| 7670688 |
Erosion-resistant components for plasma process chambers |
Tony Kaushal, Ananda H. Kumar |
2010-03-02 |
$15,045,000 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Zhihong Wang, Daxin Mao, Renhe Jia, Stan Tsai, Yongqi Hu +2 more |
2009-09-01 |
$35,895,000 |
| 7576007 |
Method for electrochemically mechanically polishing a conductive material on a substrate |
Zhihong Wang, Renhe Jia, Stan Tsai, Yongqi Hu |
2009-08-18 |
$17,494,000 |
| 7504018 |
Electrochemical method for Ecmp polishing pad conditioning |
Stan Tsai, Lakshmanan Karuppiah, Jie Diao, Renhe Jia, Alpay Yilmaz |
2009-03-17 |
$10,205,000 |
| 7422982 |
Method and apparatus for electroprocessing a substrate with edge profile control |
Jie Diao, Stan Tsai, Lakshmanan Karuppiah |
2008-09-09 |
$16,131,000 |
| 7344432 |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
Liang-Yun Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl +9 more |
2008-03-18 |
$36,315,000 |
| 7214297 |
Substrate support element for an electrochemical plating cell |
Anzhong Chang, John O. Dukovic |
2007-05-08 |
$26,598,000 |
| 6639783 |
Multi-layer ceramic electrostatic chuck with integrated channel |
Shamouil Shamouilian, Ananda H. Kumar |
2003-10-28 |
$43,198,000 |
| 6583980 |
Substrate support tolerant to thermal expansion stresses |
Arnold Kholodenko, Shamouil Shamouilian, Alexander Veytser, Wing Cheng |
2003-06-24 |
$19,441,000 |
| 6538872 |
Electrostatic chuck having heater and method |
Shamouil Shamouilian, Arnold Kholodenko, Alexander Veytser, Surinder Bedi, Kadthala Ramaya Narendrnath +4 more |
2003-03-25 |
$28,989,000 |
| 6503368 |
Substrate support having bonded sections and method |
Arnold Kholodenko, Vijay D. Parkhe, Shamouil Shamouilian, Wing Cheng, Alexander Veytser |
2003-01-07 |
$25,673,000 |
| 6490146 |
Electrostatic chuck bonded to base with a bond layer and method |
Shamouil Shamouilian, Arnold Kholodenko, Alexander Veytser, Surinder Bedi, Kadthala Ramaya Narendrnath +4 more |
2002-12-03 |
$24,582,000 |
| 6490145 |
Substrate support pedestal |
Arnold Kholodenko, Tony Kaushal, Semyon L. Kats |
2002-12-03 |
$24,582,000 |
| 6462928 |
Electrostatic chuck having improved electrical connector and method |
Shamouil Shamouilian, Surinder Bedi, Arnold Kholodenko, Alexander Veytser, Kadthala Ramaya Narendrnath +4 more |
2002-10-08 |
$23,649,000 |
| 6310755 |
Electrostatic chuck having gas cavity and method |
Arnold Kholodenko, Shamouil Shamouilian, Wing Cheng, Alexander Veytser, Surinder Bedi +4 more |
2001-10-30 |
$79,129,000 |
| 6094334 |
Polymer chuck with heater and method of manufacture |
Surinder Bedi, Shamouil Shamouilian, Syed H. Askari, Arnold Kholodenko, Jon Clinton +2 more |
2000-07-25 |
$174,627,000 |
