Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496190 | Feedback of layer thickness timing and clearance timing for polishing control | Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Boguslaw A. Swedek, Wen-Chiang Tu +1 more | 2016-11-15 |
| 9073169 | Feedback control of polishing using optical detection of clearance | Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, You Wang +5 more | 2015-07-07 |
| 8989890 | GST film thickness monitoring | Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Boguslaw A. Swedek, Wen-Chiang Tu +1 more | 2015-03-24 |
| 8855440 | Structure-independent analysis of 3-D seismic random noise | Saleh Al-Dossary | 2014-10-07 |
| 8639377 | Metrology for GST film thickness and phase | Kun Xu, Feng Q. Liu, Abraham Ravid, Wen-Chiang Tu | 2014-01-28 |
| 8586481 | Chemical planarization of copper wafer polishing | You Wang, Wen-Chiang Tu, Feng Q. Liu, Lakshmanan Karuppiah, William H. McClintock +1 more | 2013-11-19 |
| 8221193 | Closed loop control of pad profile based on metrology feedback | Shou-Sung Chang, Hung Chih Chen, Stan Tsai | 2012-07-17 |
| 8210900 | Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery | Wen-Chiang Tu, You Wang, Lakshmanan Karuppiah | 2012-07-03 |
| 8170288 | Reducing noise in 3D seismic data while preserving structural details | Saleh Al-Dossary | 2012-05-01 |
| 8012000 | Extended pad life for ECMP and barrier removal | Robert Ewald, Wei-Yung Hsu, Liang-Yuh Chen | 2011-09-06 |
| 7955519 | Composition and method for planarizing surfaces | Jason Aggio, Bin Lu, John Parker, Renjie Zhou | 2011-06-07 |
| 7653258 | Enhanced isotropic 2D and 3D gradient method | Yi Luo, Mohammed N. Alfaraj | 2010-01-26 |
| 7454292 | Inverse-vector method for smoothing dips and azimuths | Yi Luo, Mohammed N. Alfaraj | 2008-11-18 |
| 7344432 | Conductive pad with ion exchange membrane for electrochemical mechanical polishing | Liang-Yun Chen, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler +9 more | 2008-03-18 |
| 7311592 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler +4 more | 2007-12-25 |
| 7137879 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler +4 more | 2006-11-21 |
| 7091604 | Three dimensional integrated circuits | Ian Wylie, Heinz H. Busta, David Schroeder, J. Scott Steckenrider | 2006-08-15 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler +4 more | 2006-06-27 |
| 6988942 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler +4 more | 2006-01-24 |
| 6984587 | Integrated polishing and electroless deposition | — | 2006-01-10 |
| 6942546 | Endpoint detection for non-transparent polishing member | Mukesh Desai, Efrain Velazquez | 2005-09-13 |
| 6926589 | Chemical mechanical polishing apparatus and methods using a flexible pad and variable fluid flow for variable polishing | Douglas W. Young, Brett E. McGrath | 2005-08-09 |
| 6908374 | Chemical mechanical polishing endpoint detection | Bernard Frey, Bulent M. Basol, Douglas W. Young, Homayoun Talieh, Efrain Velazquez | 2005-06-21 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Lizhong Sun, Feng Q. Liu, Yan Wang, Siew Neo +1 more | 2005-05-31 |
| 6872329 | Chemical mechanical polishing composition and process | Rajeev Bajaj, Fred C. Redeker, Shijian Li | 2005-03-29 |