Issued Patents All Time
Showing 1–25 of 176 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12320883 | Resistivity-based adjustment of thresholds for in-situ monitoring | Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Tzu-Yu Liu | 2025-06-03 |
| 12257665 | Machine vision as input to a CMP process control algorithm | Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Dominic J. Benvegnu, Thomas H. Osterheld | 2025-03-25 |
| 12103135 | Core configuration for in-situ electromagnetic induction monitoring system | Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen | 2024-10-01 |
| 11776109 | Thickness measurement of substrate using color metrology | Nojan Motamedi, Dominic J. Benvegnu, Martin A. Josefowicz | 2023-10-03 |
| 11774235 | Grouping spectral data from polishing substrates | Jeffrey Drue David | 2023-10-03 |
| 11715672 | Endpoint detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2023-08-01 |
| 11715193 | Color imaging for CMP monitoring | Dominic J. Benvegnu, Robert D. Tolles, Abraham Ravid | 2023-08-01 |
| 11701749 | Monitoring of vibrations during chemical mechanical polishing | Dominic J. Benvegnu, Chih Chung Chou, Nicholas A. Wiswell, Thomas H. Osterheld, Jeonghoon Oh | 2023-07-18 |
| 11699595 | Imaging for monitoring thickness in a substrate cleaning system | Dominic J. Benvegnu, Jun Qian, Thomas H. Osterheld | 2023-07-11 |
| 11691244 | Multi-toothed, magnetically controlled retaining ring | — | 2023-07-04 |
| 11638982 | Core configuration for in-situ electromagnetic induction monitoring system | Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen | 2023-05-02 |
| 11577356 | Machine vision as input to a CMP process control algorithm | Benjamin Cherian, Jun Qian, Nicholas A. Wiswell, Dominic J. Benvegnu, Thomas H. Osterheld | 2023-02-14 |
| 11557048 | Thickness measurement of substrate using color metrology | Dominic J. Benvegnu | 2023-01-17 |
| 11199605 | Resistivity-based adjustment of measurements from in-situ monitoring | Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Tzu-Yu Liu | 2021-12-14 |
| 11183435 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2021-11-23 |
| 11100628 | Thickness measurement of substrate using color metrology | Nojan Motamedi, Dominic J. Benvegnu, Martin A. Josefowicz | 2021-08-24 |
| 11079459 | Resistivity-based calibration of in-situ electromagnetic inductive monitoring | Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Tzu-Yu Liu | 2021-08-03 |
| 11004708 | Core configuration with alternating posts for in-situ electromagnetic induction monitoring system | Hassan G. Iravani, Tzu-Yu Liu, Kun Xu, Shih-Haur Shen | 2021-05-11 |
| 10994389 | Polishing apparatus using neural network for monitoring | Kun Xu, Hassan G. Iravani, Denis Ivanov, Shih-Haur Shen, Harry Q. Lee +1 more | 2021-05-04 |
| 10948900 | Display of spectra contour plots versus time for semiconductor processing system control | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu | 2021-03-16 |
| 10766119 | Spectra based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, Jeffrey Drue David | 2020-09-08 |
| 10741459 | Inductive monitoring of conductive loops | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2020-08-11 |
| 10589397 | Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing | Alain Duboust, Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson +4 more | 2020-03-17 |
| 10565701 | Color imaging for CMP monitoring | Dominic J. Benvegnu, Robert D. Tolles, Abraham Ravid | 2020-02-18 |
| 10556315 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2020-02-11 |