Issued Patents All Time
Showing 51–75 of 176 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9221147 | Endpointing with selective spectral monitoring | Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Jeffrey Drue David +2 more | 2015-12-29 |
| 9205527 | In-situ monitoring system with monitoring of elongated region | Kun Xu, Shih-Haur Shen, Tzu-Yu Liu, Ingemar Carlsson, Hassan G. Iravani +2 more | 2015-12-08 |
| 9186774 | X-ray metrology for control of polishing | Dominic J. Benvegnu, Wen-Chiang Tu | 2015-11-17 |
| 9168630 | User-input functions for data sequences in polishing endpoint detection | Harry Q. Lee, Jeffrey Drue David, Dominic J. Benvegnu | 2015-10-27 |
| 9142466 | Using spectra to determine polishing endpoints | Harry Q. Lee, Dominic J. Benvegnu, Jeffrey Drue David | 2015-09-22 |
| 9138858 | Thin polishing pad with window and molding process | Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld | 2015-09-22 |
| 9117751 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2015-08-25 |
| 9095952 | Reflectivity measurements during polishing using a camera | Dominic J. Benvegnu | 2015-08-04 |
| 9073169 | Feedback control of polishing using optical detection of clearance | Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, You Wang +5 more | 2015-07-07 |
| 9056383 | Path for probe of spectrographic metrology system | Jeffrey Drue David, Benjamin Cherian, Dominic J. Benvegnu, Thomas H. Osterheld, Jun Qian +4 more | 2015-06-16 |
| 9023667 | High sensitivity eddy current monitoring system | Hassan G. Iravani, Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Wen-Chiang Tu | 2015-05-05 |
| 8992286 | Weighted regression of thickness maps from spectral data | Benjamin Cherian, Jeffrey Drue David, Dominic J. Benvegnu, Jun Qian, Thomas H. Osterheld | 2015-03-31 |
| 8989890 | GST film thickness monitoring | Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Yuchun Wang, Wen-Chiang Tu +1 more | 2015-03-24 |
| 8977379 | Endpoint method using peak location of spectra contour plots versus time | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu | 2015-03-10 |
| 8954186 | Selecting reference libraries for monitoring of multiple zones on a substrate | Jun Qian, Harry Q. Lee, Jeffrey Drue David, Sivakumar Dhandapani, Thomas H. Osterheld | 2015-02-10 |
| 8932107 | Gathering spectra from multiple optical heads | Jeffrey Drue David, Dominic J. Benvegnu, Sivakumar Dhandapani | 2015-01-13 |
| 8874250 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah | 2014-10-28 |
| 8858298 | Polishing pad with two-section window having recess | Manoocher Birang | 2014-10-14 |
| 8815109 | Spectra based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, Jeffrey Drue David | 2014-08-26 |
| 8758086 | Friction sensor for polishing system | Gabriel L. Miller, Manoocher Birang, Nils Johansson, Dominic J. Benvegnu | 2014-06-24 |
| 8755928 | Automatic selection of reference spectra library | Jimin Zhang, Harry Q. Lee, Zhihong Wang, Jeffrey Drue David, Dominic J. Benvegnu | 2014-06-17 |
| 8751033 | Adaptive tracking spectrum features for endpoint detection | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee | 2014-06-10 |
| 8718810 | Semi-quantitative thickness determination | Dominic J. Benvegnu, Jeffrey Drue David, Harry Q. Lee | 2014-05-06 |
| 8694144 | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing | Alain Duboust, Stephen Jew, David H. Mai, Huyen Tran, Wen-Chiang Tu +4 more | 2014-04-08 |
| 8679979 | Using optical metrology for within wafer feed forward process control | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu | 2014-03-25 |