Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908718 | In-situ metrology and process control | Ramesh Krishnamurthy | 2024-02-20 |
| 11289352 | In-situ metrology and process control | Ramesh Krishnamurthy | 2022-03-29 |
| 9862070 | Systems and methods for substrate polishing end point detection using improved friction measurement | Shou-Sung Chang, Hung Chih Chen, Paul D. Butterfield, Erik S. Rondum | 2018-01-09 |
| 9711381 | Methods and apparatus for post-chemical mechanical planarization substrate cleaning | Sen-Hou Ko | 2017-07-18 |
| 9646859 | Disk-brush cleaner module with fluid jet | Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank +2 more | 2017-05-09 |
| 9472475 | Feedback control using detection of clearance and adjustment for uniform topography | Kun Xu, Ingemar Carlsson, Tzu-Yu Liu, Shih-Haur Shen, Boguslaw A. Swedek +1 more | 2016-10-18 |
| 9431267 | Semiconductor device processing tools and methods for patterning substrates | Mayur Trivedi, Sushil Padiyar, Randhir P. S. Thakur | 2016-08-30 |
| 9073169 | Feedback control of polishing using optical detection of clearance | Kun Xu, Ingemar Carlsson, Feng Q. Liu, David Maxwell Gage, You Wang +5 more | 2015-07-07 |
| 9061394 | Systems and methods for substrate polishing end point detection using improved friction measurement | Shou-Sung Chang, Hung Chih Chen, Paul D. Butterfield, Erik S. Rondum | 2015-06-23 |
| 8874250 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek | 2014-10-28 |
| 8813293 | Apparatus and methods for brush and pad conditioning | Sen-Hou Ko | 2014-08-26 |
| 8628376 | In-line wafer thickness sensing | Garrett H. Sin, Sanjeev Kumar Jain, Boguslaw A. Swedek | 2014-01-14 |
| 8586481 | Chemical planarization of copper wafer polishing | You Wang, Wen-Chiang Tu, Feng Q. Liu, Yuchun Wang, William H. McClintock +1 more | 2013-11-19 |
| 8554351 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek | 2013-10-08 |
| 8458843 | Apparatus and methods for brush and pad conditioning | Sen-Hou Ko | 2013-06-11 |
| 8337278 | Wafer edge characterization by successive radius measurements | Ignasi Palou-Rivera, Boguslaw A. Swedek | 2012-12-25 |
| 8260446 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek | 2012-09-04 |
| 8250695 | Roller assembly for a brush cleaning device in a cleaning module | Dan Zhang, Simon Yavelberg, Jim K. Atkinson, Hung Chih Chen, Noel Manto +1 more | 2012-08-28 |
| 8211325 | Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications | Jie Diao, Garlen C. Leung, Christopher Heung-Gyun Lee | 2012-07-03 |
| 8210900 | Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery | Wen-Chiang Tu, You Wang, Yuchun Wang | 2012-07-03 |
| 8172643 | Polishing system having a track | Alpay Yilmaz, Allen L. D'Ambra, Jagan Rangarajan | 2012-05-08 |
| 8014004 | Determining physical property of substrate | Abraham Ravid, Boguslaw A. Swedek, Jeffrey Drue David, Jun Qian, Ingemar Carlsson +2 more | 2011-09-06 |
| 7952708 | High throughput measurement system | Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian +3 more | 2011-05-31 |
| 7914363 | Smart conditioner rinse station | Alpay Yilmaz | 2011-03-29 |
| 7840375 | Methods and apparatus for generating a library of spectra | Abraham Ravid, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian +3 more | 2010-11-23 |